Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more informationPBSS4032SPN
30 V, 5.7 A NPN/PNP low VCEsat (BISS) transistor
NPN /PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT96-1 (SO8) Surface-Mounted Device (SMD) plastic package.
Features and benefits
- High collector current capability IC and ICM
- High collector current gain (hFE) at high IC
- High energy efficiency due to less heat generation
- Low collector-emitter saturation voltage VCEsat
- Optimized switching time
- Smaller required PCB area than for conventional transistors
Applications
- Battery-driven devices
- Charging circuits
- DC-to-DC conversion
- Power management
參數類型
| 型號 | Package version | Package name | Size (mm) | channel type (e) | Configuration | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|
| PBSS4032SPN | SOT96-1 | SO8 | 4.9 x 3.9 x 1.75 | NPN/PNP | 2 | 730.0 | 30.0 | 4800.0 | 300.0 | N |
封裝
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PBSS4032SPN | PBSS4032SPN,115 (934063417115) |
Withdrawn / End-of-life | 4032SPN |
SO8 (SOT96-1) |
SOT96-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT96-1_115 |
環境信息
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PBSS4032SPN | PBSS4032SPN,115 | PBSS4032SPN |
|
|
文檔 (13)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PBSS4032SPN | 30 V NPN/PNP low V_CEsat (BISS) transistor | Data sheet | 2018-08-28 |
| AN10909 | Low VCEsat transistors in medium power loadswitch applications | Application note | 2013-03-14 |
| AN11045 | Next generation of NXP low VCEsat transistors: improved technology for discrete semiconductors | Application note | 2013-03-04 |
| AN11076 | Thermal behavior of small-signal discretes on multilayer PCBs | Application note | 2021-06-23 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO8_SOT96-1_mk | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SOT96-1 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Package information | 2020-04-21 |
| PBSS4032SPN_Nexperia_Product_Reliability | PBSS4032SPN Nexperia Product Reliability | Quality document | 2019-04-29 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| PBSS4032SPN | PBSS4032SPN SPICE model | SPICE model | 2025-07-09 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PBSS4032SPN | PBSS4032SPN SPICE model | SPICE model | 2025-07-09 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.