可訂購部件
| 型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經(jīng)銷商處購買 |
|---|---|---|---|---|
| 74LV07APW | 74LV07APWJ | 935308208118 | SOT402-1 | 訂單產(chǎn)品 |
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Click here for more information74LV07APW
Hex buffer with open-drain outputs
The 74LV07A is a hex buffer with open-drain outputs. The outputs are open-drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.
Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments.
Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 2.0 V to 5.5 V
Maximum tPZL of 7.2 ns at 5 V
Typical VOL(p) < 0.8 V at VCC = 3.3 V, Tamb = 25 °C
Supports mixed-mode voltage operation on all ports
IOFF circuitry provides partial Power-down mode operation
Latch-up performance exceeds 250 mA per JESD 78 Class II
- ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 3000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 2000 V
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LV07APW | 2.0?-?5.5 | CMOS | ± 12 | 60 | 6 | low | -40~125 | 143 | 7.9 | 69 | TSSOP14 |
PCB Symbol, Footprint and 3D Model
| Model Name | 描述 |
|---|---|
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封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LV07APW | 74LV07APWJ (935308208118) |
Active | LV07A |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
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SOT402-1_118 |
文檔 (11)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LV07A | Hex buffer with open-drain outputs | Data sheet | 2024-04-08 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| lv07a | lv07a IBIS model | IBIS model | 2017-06-02 |
| Nexperia_document_leaflet_Logic_LV-AT_201903 | LV-A(T) logic family | Leaflet | 2019-03-19 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SOT402-1_118 | TSSOP14; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2025-01-16 |
| 74LV07APW_Nexperia_Product_Reliability | 74LV07APW Nexperia Product Reliability | Quality document | 2025-03-20 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
PCB Symbol, Footprint and 3D Model
| Model Name | 描述 |
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訂購、定價(jià)與供貨
| 型號 | Orderable part number | Ordering code (12NC) | 狀態(tài) | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| 74LV07APW | 74LV07APWJ | 935308208118 | Active | SOT402-1_118 | 2,500 |
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樣品
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.