外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發行日期 |
|---|---|---|---|---|
| SOT8083-1 | HTSSOP24 | plastic, thermal enhanced thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm × 4.4 mm × 1.2 mm body | MO-153 (JEDEC) | 2024-12-24 |
相關文檔
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT8083-1 | plastic, thermal enhanced thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm × 4.4 mm × 1.2 mm body | Package information | 2025-01-10 |
| SOT8083-1_518 | HTSSOP24; Reel dry pack for SMD 13''; Q1/T1 product orientation | Packing information | 2024-06-18 |
采用此封裝的產品
Analog & Logic ICs
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| NEX13120PC-Q100 | 12-channel automotive linear LED driver |
Automotive qualified products (AEC-Q100/Q101)
| 型號 | 描述 | 快速訪問 |
|---|---|---|
| NEX13120PC-Q100 | 12-channel automotive linear LED driver |