Features and benefits
Wide supply voltage range from 2.0 to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
Latch-up performance exceeds 100 mA per JESD 78 Class II Level A
CMOS input levels
Multiple package options
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and from -40 °C to +125 °C.
參數類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC1G09GV | 2.0?-?5.5 | CMOS | ± 8 | 3.2 | 60 | 1 | low | -40~125 | 272 | 64.5 | 170 | TSOP5 |
| 74AHC1G09GW | 2.0?-?5.5 | CMOS | 8 | 3.2 | 60 | 1 | low | -40~125 | 312 | 82.5 | 183 | TSSOP5 |
| 74AHC1G09GZ | 2.0?-?5.5 | CMOS | 8 | 3.2 | 60 | 1 | low | -40~125 | 305 | 30 | 190 | XSON5 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC1G09GV | 74AHC1G09GV,125 (935285716125) |
Active | A09 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74AHC1G09GW | 74AHC1G09GW,125 (935279914125) |
Active | A9 |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74AHC1G09GZ | 74AHC1G09GZYL (935691641315) |
Active | A9 |
XSON5 (SOT8065-1) |
SOT8065-1 | SOT8065-1_315 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC1G09GV | 74AHC1G09GV,125 | 74AHC1G09GV |
|
|
| 74AHC1G09GW | 74AHC1G09GW,125 | 74AHC1G09GW |
|
|
| 74AHC1G09GZ | 74AHC1G09GZYL | 74AHC1G09GZ |
|
|
文檔 (18)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC1G09 | 2-input AND gate with open-drain output | Data sheet | 2024-09-19 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| 001aad600 | Block diagram: 74AHC1G09GV, 74AHC1G09GW, 74AUP1G09GF, 74AUP1G09GM, 74AUP1G09GW | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| ahc1g09 | 74AHC1G09 IBIS model | IBIS model | 2019-01-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Leaflet_SOT8065_Minilogic | Leaflet_SOT8065 Minilogic | Leaflet | 2024-11-15 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-08-28 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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