NEVB-LOGIC04封裝尺寸適配板
NEVB-LOGIC04 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
NEVB-LOGIC04封裝尺寸適配板
主要特性與優勢
Plug and play: identify the package you will be using, place the device in the footprint and solder the device down to start evaluating
Packages on the board (5)
| 封裝 | 封裝名稱 | 封裝版本 | 封裝說明 | 參考 | 發行日期 |
|---|---|---|---|---|---|
XSON5 (SOT8065-1) |
XSON5 | SOT8065-1 | Plastic thermal enhanced extremely thin small outline package with side-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | MO-340 (JEDEC) | 2024-08-27 |
DHXQFN14 (SOT8014-1) |
DHXQFN14 | SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | 2020-09-22 | |
DHXQFN16 (SOT8016-1) |
DHXQFN16 | SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | 2020-09-22 | |
DHXQFN20 (SOT8020-1) |
DHXQFN20 | SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | 2020-09-22 | |
DHXQFN24 (SOT8024-1) |
DHXQFN24 | SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | 2020-09-22 |
相關板塊 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
|
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
|
nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board |
Packages on the board (5)
| 封裝 | 封裝名稱 | 封裝版本 | 封裝說明 | 參考 | 發行日期 |
|---|---|---|---|---|---|
|
XSON5 (SOT8065-1) |
XSON5 | SOT8065-1 | Plastic thermal enhanced extremely thin small outline package with side-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | MO-340 (JEDEC) | 2024-08-27 |
|
DHXQFN14 (SOT8014-1) |
DHXQFN14 | SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | 2020-09-22 | |
|
DHXQFN16 (SOT8016-1) |
DHXQFN16 | SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | 2020-09-22 | |
|
DHXQFN20 (SOT8020-1) |
DHXQFN20 | SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | 2020-09-22 | |
|
DHXQFN24 (SOT8024-1) |
DHXQFN24 | SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | 2020-09-22 |
相關板塊 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
|
|
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
|
|
nevb-logic03-footprint-adapter-board | NEVB-LOGIC03 footprint adapter board | Evaluation board |
文檔 (5)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT8014-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8016-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | Package information | 2023-02-03 |
| SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8024-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-08-28 |