NEVB-LOGIC03封裝尺寸適配板
NEVB-LOGIC03是一款雙列內嵌式邏輯器件封裝尺寸適配板，其設計旨在通過提供多種封裝尺寸，簡化對Nexperia邏輯器件的評估過程。
Packages on the board (4)
| 封裝 | 封裝名稱 | 封裝版本 | 封裝說明 | 參考 | 發行日期 |
|---|---|---|---|---|---|
WLCSP8 (SOT8023-1) |
WLCSP8 | SOT8023-1 | wafer level chip-scale package, 8 bumps; 0.75 x 1.55 x 0.60 mm | 2020-08-12 | |
WLCSP16 (SOT8025-1) |
WLCSP16 | SOT8025-1 | wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod | 2021-06-16 | |
WLCSP9 (SOT8027-1) |
WLCSP9 | SOT8027-1 | wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | 2021-06-16 | |
WLCSP9 (SOT8057-1) |
WLCSP9 | SOT8057-1 | wafer level chip-scale pakage; 9 bumps; 0.92 × 0.92 × 0.42 mm body | 2023-06-01 |
相關板塊 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
|
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
|
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
Packages on the board (4)
| 封裝 | 封裝名稱 | 封裝版本 | 封裝說明 | 參考 | 發行日期 |
|---|---|---|---|---|---|
|
WLCSP8 (SOT8023-1) |
WLCSP8 | SOT8023-1 | wafer level chip-scale package, 8 bumps; 0.75 x 1.55 x 0.60 mm | 2020-08-12 | |
|
WLCSP16 (SOT8025-1) |
WLCSP16 | SOT8025-1 | wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod | 2021-06-16 | |
|
WLCSP9 (SOT8027-1) |
WLCSP9 | SOT8027-1 | wafer level chip-scale package; 9 bumps; 1.06 mm x 1.06 mm x 0.43 mm body | 2021-06-16 | |
|
WLCSP9 (SOT8057-1) |
WLCSP9 | SOT8057-1 | wafer level chip-scale pakage; 9 bumps; 0.92 × 0.92 × 0.42 mm body | 2023-06-01 |
相關板塊 (3)
| Board | Description | Type | Quick links | Shop link | |
|---|---|---|---|---|---|
|
|
nevb-logic01-footprint-adapter-board | NEVB-LOGIC01 footprint adapter board | Evaluation board | ||
|
|
nevb-logic02-footprint-adapter-board | NEVB-LOGIC02 footprint adapter board | Evaluation board | ||
|
|
nevb-logic04-footprint-adapter-board | Logic footprint adapter board (NEVB-LOGIC04) | Evaluation board |
文檔 (1)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| nexperia_factsheet_dual_in_line_logic_footprint_adapter_boards | Dual in-line Logic footprint adapter boards | Leaflet | 2024-01-24 |