74HC573-Q100; 74HCT573-Q100
Octal D-type transparent latch; 3-state
The 74HC573-Q100; 74HCT573-Q100 is an 8-bit D-type transparent latch with 3-state outputs. The device features latch enable (LE) and output enable (OE) inputs. When LE is HIGH, data at the inputs enter the latches. In this condition the latches are transparent, a latch output will change each time its corresponding D-input changes. When LE is LOW the latches store the information that was present at the inputs a set-up time preceding the HIGH-to-LOW transition of LE. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the latches. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
- Wide supply voltage range from 2.0 V to 6.0 V
- CMOS low power dissipation
- High noise immunity
Input levels:
For 74HC573-Q100: CMOS level
For 74HCT573-Q100: TTL level
Inputs and outputs on opposite sides of package allowing easy interface with microprocessors
Useful as input or output port for microprocessors and microcomputers
3-state non-inverting outputs for bus-oriented applications
Common 3-state output enable input
Multiple package options
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
參數(shù)類(lèi)型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC573BQ-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 14 | 8 | low | -40~125 | 79 | 9.4 | 50 | DHVQFN20 |
| 74HC573D-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 14 | 8 | low | -40~125 | 85 | 27.5 | 61 | SO20 |
| 74HC573PW-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 14 | 8 | low | -40~125 | 100 | 4.6 | 44.9 | TSSOP20 |
| 74HCT573BQ-Q100 | 4.5?-?5.5 | TTL | ± 6 | 17 | 8 | low | -40~125 | 79 | 9.4 | 50 | DHVQFN20 |
| 74HCT573D-Q100 | 4.5?-?5.5 | TTL | ± 6 | 17 | 8 | low | -40~125 | 85 | 27.5 | 61 | SO20 |
| 74HCT573PW-Q100 | 4.5?-?5.5 | TTL | ± 6 | 17 | 8 | low | -40~125 | 100 | 4.6 | 44.9 | TSSOP20 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC573BQ-Q100 | 74HC573BQ-Q100,115 (935298863115) |
Active | HC573 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HC573D-Q100 | 74HC573D-Q100,118 (935298864118) |
Active | 74HC573D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HC573PW-Q100 | 74HC573PW-Q100,118 (935298865118) |
Active | HC573 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74HCT573BQ-Q100 | 74HCT573BQ-Q100,11 (935298866115) |
Active | HCT573 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HCT573D-Q100 | 74HCT573D-Q100,118 (935298867118) |
Active | 74HCT573D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74HCT573PW-Q100 | 74HCT573PW-Q100,11 (935298868118) |
Active | HCT573 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC573DB-Q100 | 74HC573DB-Q100J (935300897118) |
Obsolete | no package information | ||||
| 74HCT573DB-Q100 | 74HCT573DB-Q100J (935301414118) |
Obsolete | HCT573 |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT339-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC573BQ-Q100 | 74HC573BQ-Q100,115 | 74HC573BQ-Q100 |
|
|
| 74HC573D-Q100 | 74HC573D-Q100,118 | 74HC573D-Q100 |
|
|
| 74HC573PW-Q100 | 74HC573PW-Q100,118 | 74HC573PW-Q100 |
|
|
| 74HCT573BQ-Q100 | 74HCT573BQ-Q100,11 | 74HCT573BQ-Q100 |
|
|
| 74HCT573D-Q100 | 74HCT573D-Q100,118 | 74HCT573D-Q100 |
|
|
| 74HCT573PW-Q100 | 74HCT573PW-Q100,11 | 74HCT573PW-Q100 |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC573DB-Q100 | 74HC573DB-Q100J | 74HC573DB-Q100 |
|
|
| 74HCT573DB-Q100 | 74HCT573DB-Q100J | 74HCT573DB-Q100 |
|
|
文檔 (18)
| 文件名稱 | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74HC_HCT573_Q100 | Octal D-type transparent latch; 3-state | Data sheet | 2024-08-05 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| hc573 | 74HC573 IBIS model | IBIS model | 2020-12-07 |
| hct573 | 74HCT573 IBIS model | IBIS model | 2020-12-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| hc573 | 74HC573 IBIS model | IBIS model | 2020-12-07 |
| hct573 | 74HCT573 IBIS model | IBIS model | 2020-12-08 |
Ordering, pricing & availability
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