74LVC1G86
2-input EXCLUSIVE-OR gate
The 74LVC1G86 provides the 2-input EXCLUSIVE-OR function.
Inputs can be driven from either 3.3 V or 5 V devices. These features allow the use of these devices in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
High noise immunity
Overvoltage tolerant inputs to 5.5 V
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
JESD36 (4.5 V to 5.5 V)
±24 mA output drive (VCC = 3.0 V)
CMOS low power dissipation
Latch-up performance exceeds 250 mA
IOFF circuitry provides partial Power-down mode operation
Direct interface with TTL levels
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G86GM | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 1 | low | -40~125 | 313 | 7.8 | 158 | XSON6 |
| 74LVC1G86GN | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 1 | low | -40~125 | 338 | 23.5 | 210 | XSON6 |
| 74LVC1G86GS | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 1 | low | -40~125 | 325 | 29.9 | 218 | XSON6 |
| 74LVC1G86GV | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 1 | low | -40~125 | 270 | 63.3 | 169 | TSOP5 |
| 74LVC1G86GW | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 1 | low | -40~125 | 311 | 80.9 | 181 | TSSOP5 |
| 74LVC1G86GX | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 1 | low | -40~125 | 327 | 94.5 | 195 | X2SON5 |
| 74LVC1G86GZ | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 2.4 | 150 | 1 | low | -40~125 | 304 | 30 | 189 | XSON5 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G86GM | 74LVC1G86GM,115 (935277202115) |
Active | VH |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74LVC1G86GM,132 (935277202132) |
Active | VH | SOT886_132 | ||||
| 74LVC1G86GN | 74LVC1G86GN,132 (935291794132) |
Active | VH |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
| 74LVC1G86GS | 74LVC1G86GS,132 (935292922132) |
Active | VH |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
| 74LVC1G86GV | 74LVC1G86GV,125 (935272026125) |
Active | V86 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74LVC1G86GW | 74LVC1G86GW,125 (935268824125) |
Active | VH |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74LVC1G86GX | 74LVC1G86GX,125 (935298385125) |
Active | VH |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 | |
| 74LVC1G86GZ | 74LVC1G86GZYL (935691731315) |
Active | VH |
XSON5 (SOT8065-1) |
SOT8065-1 | SOT8065-1_315 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G86GF | 74LVC1G86GF,132 (935282427132) |
Obsolete |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
SOT891_132 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G86GM | 74LVC1G86GM,115 | 74LVC1G86GM |
|
|
| 74LVC1G86GM | 74LVC1G86GM,132 | 74LVC1G86GM |
|
|
| 74LVC1G86GN | 74LVC1G86GN,132 | 74LVC1G86GN |
|
|
| 74LVC1G86GS | 74LVC1G86GS,132 | 74LVC1G86GS |
|
|
| 74LVC1G86GV | 74LVC1G86GV,125 | 74LVC1G86GV |
|
|
| 74LVC1G86GW | 74LVC1G86GW,125 | 74LVC1G86GW |
|
|
| 74LVC1G86GX | 74LVC1G86GX,125 | 74LVC1G86GX |
|
|
| 74LVC1G86GZ | 74LVC1G86GZYL | 74LVC1G86GZ |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G86GF | 74LVC1G86GF,132 | 74LVC1G86GF |
|
|
文檔 (39)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC1G86 | 2-input EXCLUSIVE-OR gate | Data sheet | 2024-11-13 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| mna038 | Block diagram: 74AHC1G86GV, 74AHC1G86GW, 74AHCT1G86GV, 74AHCT1G86GW, 74HC1G86GV, 74HC1G86GW, 74HCT1G86GV, 74HCT1G86GW, 74LVC1G86GF, 74LVC1G86GM, 74LVC1G86GV, 74LVC1G86GW | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| lvc1g86 | 74LVC1G86 IBIS model | IBIS model | 2014-10-20 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Leaflet_SOT8065_Minilogic | Leaflet_SOT8065 Minilogic | Leaflet | 2024-11-15 |
| DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| SOT8065-1 | Plastic thermal enhanced extremely thin small outline package withside-wettable flanks (SWF); no leads; 5 terminals; body 1.1 × 0.85 × 0.5mm | Package information | 2024-08-28 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| SOT8065-1 | 3D model for products with SOT8065-1 package | Design support | 2024-11-05 |
| lvc1g86 | 74LVC1G86 IBIS model | IBIS model | 2014-10-20 |
Ordering, pricing & availability
樣品
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