Features and benefits
Wide supply voltage range from 2.0 V to 5.5 V
Input levels:
For 74AHC86: CMOS level
For 74AHCT86: TTL level
Balanced propagation delays
All inputs have Schmitt-trigger actions
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD 78 Class II Level A
Multiple package options
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
參數類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC86BQ | 2.0?-?5.5 | CMOS | ± 8 | 3.4 | 60 | 4 | low | -40~125 | 103 | 18.4 | 71 | DHVQFN14 |
| 74AHC86D | 2.0?-?5.5 | CMOS | ± 8 | 3.4 | 60 | 4 | low | -40~125 | 105 | 17.8 | 63 | SO14 |
| 74AHC86PW | 2.0?-?5.5 | CMOS | ± 8 | 3.4 | 60 | 4 | low | -40~125 | 138 | 6.9 | 64 | TSSOP14 |
| 74AHCT86BQ | 4.5?-?5.5 | TTL | ± 8 | 3.4 | 60 | 4 | low | -40~125 | 103 | 18.4 | 71 | DHVQFN14 |
| 74AHCT86D | 4.5?-?5.5 | TTL | ± 8 | 3.4 | 60 | 4 | low | -40~125 | 105 | 17.8 | 63 | SO14 |
| 74AHCT86PW | 4.5?-?5.5 | TTL | ± 8 | 3.4 | 60 | 4 | low | -40~125 | 138 | 1 | 64 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC86BQ | 74AHC86BQ,115 (935285547115) |
Active | AHC86 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHC86D | 74AHC86D,118 (935263563118) |
Active | 74AHC86D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHC86PW | 74AHC86PW,118 (935263564118) |
Active | AHC86 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
| 74AHCT86BQ | 74AHCT86BQ,115 (935285548115) |
Active | AHT86 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74AHCT86D | 74AHCT86D,118 (935263554118) |
Active | 74AHCT86D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74AHCT86PW | 74AHCT86PW,118 (935263555118) |
Active | AHCT86 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
環境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC86BQ | 74AHC86BQ,115 | 74AHC86BQ |
|
|
| 74AHC86D | 74AHC86D,118 | 74AHC86D |
|
|
| 74AHC86PW | 74AHC86PW,118 | 74AHC86PW |
|
|
| 74AHCT86BQ | 74AHCT86BQ,115 | 74AHCT86BQ |
|
|
| 74AHCT86D | 74AHCT86D,118 | 74AHCT86D |
|
|
| 74AHCT86PW | 74AHCT86PW,118 | 74AHCT86PW |
|
|
文檔 (18)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT86 | Quad 2-input EXCLUSIVE-OR gate | Data sheet | 2024-03-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc86 | ahc86 IBIS model | IBIS model | 2013-04-08 |
| ahct86 | ahct86 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要設計/技術支持，請告知我們并填寫 應答表 我們會盡快回復您。
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| ahc86 | ahc86 IBIS model | IBIS model | 2013-04-08 |
| ahct86 | ahct86 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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