74AUP2G3407
Low-power single buffer; single buffer with open-drain
The 74AUP2G3407 is a single buffer and a single buffer with open-drain output. It features two input pins (nA), an output pin (1Y) and an open-drain output pin (2Y).
Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
Low static power consumption; ICC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial power-down mode operation
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類(lèi)型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP2G3407GM | 0.8?-?3.6 | CMOS | ± 1.9 | 4.1 | 70 | 2 | ultra low | -40~125 | 290 | 6.5 | 145 | XSON6 |
| 74AUP2G3407GN | 0.8?-?3.6 | CMOS | ± 1.9 | 4.1 | 70 | 2 | ultra low | -40~125 | 275 | 11.7 | 171 | XSON6 |
| 74AUP2G3407GS | 0.8?-?3.6 | CMOS | ± 1.9 | 4.1 | 70 | 2 | ultra low | -40~125 | 272 | 14.8 | 177 | XSON6 |
| 74AUP2G3407GW | 0.8?-?3.6 | CMOS | ± 1.9 | 4.1 | 70 | 2 | ultra low | -40~125 | 264 | 38.6 | 153 | TSSOP6 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP2G3407GM | 74AUP2G3407GMH (935302421125) |
Active | aJ |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
| 74AUP2G3407GN | 74AUP2G3407GNH (935302423125) |
Active | aJ |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
暫無(wú)信息 |
| 74AUP2G3407GS | 74AUP2G3407GSH (935302424125) |
Active | aJ |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暫無(wú)信息 |
| 74AUP2G3407GW | 74AUP2G3407GWH (935302419125) |
Active | aJ |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP2G3407GM | 74AUP2G3407GMH | 74AUP2G3407GM |
|
|
| 74AUP2G3407GN | 74AUP2G3407GNH | 74AUP2G3407GN |
|
|
| 74AUP2G3407GS | 74AUP2G3407GSH | 74AUP2G3407GS |
|
|
| 74AUP2G3407GW | 74AUP2G3407GWH | 74AUP2G3407GW |
|
|
文檔 (21)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74AUP2G3407 | Low-power single buffer; single buffer with open-drain | Data sheet | 2023-07-28 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| Nexperia_document_Logic_CombinationLogic_infocard_201710 | Combination logic solutions card | Leaflet | 2019-08-09 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
Ordering, pricing & availability
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