Features and benefits
Supply voltage range from 4.5 V to 5.5 V
BiCMOS high speed and output drive
Direct interface with TTL levels
IOFF circuitry provides partial Power-down mode operation
Latch-up protection exceeds 500 mA per JESD78B class II level A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C
參數類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74ABT04D | 4.5?-?5.5 | TTL | - 15 / 20 | 100 | 6 | medium | -40~85 | 106 | 18.7 | 64 | SO14 |
| 74ABT04PW | 4.5?-?5.5 | TTL | - 15 / 20 | 100 | 6 | medium | -40~85 | 140 | 6.9 | 65.8 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ABT04D | 74ABT04D,118 (935206990118) |
Active | 74ABT04D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74ABT04PW | 74ABT04PW,118 (935207010118) |
Active | ABT04 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ABT04DB | 74ABT04DB,112 (935207000112) |
Obsolete | no package information | ||||
| 74ABT04DB,118 (935207000118) |
Obsolete | ||||||
文檔 (16)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74ABT04 | Hex inverter | Data sheet | 2024-01-18 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| sa00340 | Block diagram: 74ABT04D, 74ABT04DB, 74ABT04N, 74ABT04PW, 74LVT04D, 74LVT04DB, 74LVT04PW | Block diagram | 2009-11-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| abt04 | abt04 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| abt | abt Spice model | SPICE model | 2013-05-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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