可訂購部件
| 型號 | 可訂購的器件編號 | 訂購代碼(12NC) | 封裝 | 從經銷商處購買 |
|---|---|---|---|---|
| PESD5V0L4UF | PESD5V0L4UF,115 | 934061198115 | SOT886 | 訂單產品 |
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Low capacitance unidirectional quadruple ESD protection diode arrays
Low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode array in a leadless ultra small SOT886 Surface-Mounted Device (SMD) plastic package, designed to protect up to four signal lines from the damage caused by ESD and other transients.
Features and benefits
ESD protection of up to four lines
Low diode capacitance
Max. peak pulse power: PPP = 30 W
Low clamping voltage: VCL = 13 V
Ultra low leakage current: IRM = 5 nA
ESD protection up to 20 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5 (surge); IPP = 2.5 A
Applications
Computers and peripherals
Communication systems
Audio and video equipment
Portable electronics
Cellular handsets and accessories
Subscriber Identity Module (SIM) card protection
參數類型
| 型號 | Package name | Nr of lines | Configuration | VRWM (V) (V) | Cd [typ] (pF) | VESD IEC61000-4-2 (kV) |
|---|---|---|---|---|---|---|
| PESD5V0L4UF | XSON6 | 4 | Unidirectional | 5 | 16 | 20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PESD5V0L4UF | PESD5V0L4UF,115 (934061198115) |
Active | A6 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
文檔 (14)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PESDXL4UF_G_W | Low capacitance unidirectional quadruple ESD protection diode arrays | Data sheet | 2022-05-03 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT886_115 | XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| PESD5V0L4UF_Nexperia_Product_Reliability | PESD5V0L4UF Nexperia Product Reliability | Quality document | 2025-05-30 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| PESD5V0L4UF | PESD5V0L4UF SPICE model | SPICE model | 2012-07-22 |
| PESD5V0L4UF | PESD5V0L4UF SPICE model | SPICE model | 2025-04-07 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
Longevity
The Nexperia Longevity Program is aimed to provide our customers information from time to time about the expected time that our products can be ordered. The NLP is reviewed and updated regularly by our Executive Management Team. View our longevity program here.
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PESD5V0L4UF | PESD5V0L4UF SPICE model | SPICE model | 2012-07-22 |
| PESD5V0L4UF | PESD5V0L4UF SPICE model | SPICE model | 2025-04-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
訂購、定價與供貨
| 型號 | Orderable part number | Ordering code (12NC) | 狀態 | 包裝 | Packing Quantity | 在線購買 |
|---|---|---|---|---|---|---|
| PESD5V0L4UF | PESD5V0L4UF,115 | 934061198115 | Active | SOT886_115 | 5,000 |
|
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機構訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區分銷商網絡可為您提供 Nexperia 樣品支持。查看官方經銷商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.