74LVC1G3157-Q100
10 ? single-pole double-throw analog switch
The 74LVC1G3157-Q100 is a single-pole double-throw analog switch with a digital select input (S), two independent inputs/outputs (Y0 and Y1) and a common input/output (Z). Control inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.
Schmitt-trigger action at control inputs makes the circuit tolerant of slower input rise and fall times.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.65 V to 5.5 V
Very low ON resistance:
7.5 Ω (typical) at VCC = 2.7 V
6.5 Ω (typical) at VCC = 3.3 V
6 Ω (typical) at VCC = 5 V
32 mA continuous switch current
Break-before-make switching
High noise immunity
CMOS low power dissipation
TTL interface compatibility at 3.3 V
Latch-up performance meets requirements of JESD 78 Class I
Overvoltage tolerant control inputs to 5.5 V
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
參數類型
| 型號 | Configuration | VCC (V) | RON (Ω) | Logic switching levels | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G3157GM-Q100 | SPDT | 1.65?-?5.5 | 15 | CMOS/LVTTL | very low | -40~125 | 286 | 6.3 | 142 | XSON6 |
| 74LVC1G3157GV-Q100 | SPDT | 1.65?-?5.5 | 15 | CMOS/LVTTL | very low | -40~125 | 227 | 35.5 | 141 | TSOP6 |
| 74LVC1G3157GW-Q100 | SPDT | 1.65?-?5.5 | 15 | CMOS/LVTTL | very low | -40~125 | 261 | 35.7 | 150 | TSSOP6 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G3157GM-Q100 | 74LVC1G3157GM-Q10X (935300911115) |
Active | YJ |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74LVC1G3157GV-Q100 | 74LVC1G3157GV-Q10H (935300244125) |
Active | YJ |
TSOP6 (SOT457) |
SOT457 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT457_125 |
| 74LVC1G3157GW-Q100 | 74LVC1G3157GW-Q10H (935300245125) |
Active | YJ |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
環境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G3157GM-Q100 | 74LVC1G3157GM-Q10X | 74LVC1G3157GM-Q100 |
|
|
| 74LVC1G3157GV-Q100 | 74LVC1G3157GV-Q10H | 74LVC1G3157GV-Q100 |
|
|
| 74LVC1G3157GW-Q100 | 74LVC1G3157GW-Q10H | 74LVC1G3157GW-Q100 |
|
|
文檔 (21)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC1G3157_Q100 | 10 Ohm single-pole double-throw analog switch | Data sheet | 2023-08-23 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT457 | 3D model for products with SOT457 package | Design support | 2022-11-04 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| lvc1g3157 | 74LVC1G3157 IBIS model | IBIS model | 2016-04-27 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSOP6_SOT457_mk | plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT457 | plastic, surface-mounted package (SC-74; TSOP6); 6 leads | Package information | 2023-03-03 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT457 | MAR_SOT457 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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