LSF0101
1-bit bidirectional multi-voltage level translator; open-drain; push-pull
The LSF0101 is an 1 channel bidirectional multi-voltage level translator for open-drain and push?-?pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0101 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.
Features and benefits
Bidirectional voltage translation with no direction pin
Up translation
≤ 100 MHz; CL = 30 pF
≤ 50 MHz; CL = 50 pF
Down translation
≥ 100 MHz; CL = 30 pF
≥ 50 MHz; CL = 50 pF
Hot insertion
Bidirectional voltage level translation between:
0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
1.8 V and 2.5 V, 3.3 V and 5.0 V
2.5 V and 3.3 V and 5.0 V
3.3 V and 5.0 V
Low standby current
5 V tolerant I/O pins to support TTL
Low RON provides less signal distortion
High-impedance I/O pins for EN = Low.
Flow-through pinout for easy PCB trace routing.
Latch-up performance exceeds 100 mA per JESD78 class II level A
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +125 °C
Applications
GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure
Industrial
Personal computing
參數類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| LSF0101GM | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 0.7 | 1 | low | -40~125 | 302 | 7.2 | 153 | XSON6 | Bi-directional | AutoSense |
| LSF0101GW | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 0.7 | 1 | low | -40~125 | 273 | 46.6 | 161 | TSSOP6 | Bi-directional | AutoSense |
| LSF0101GW-Q100 | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 0.7 | 1 | low | -40~125 | 273 | 46.6 | 161 | TSSOP6 | Bi-directional | AutoSense |
| LSF0101GX | 0.95?-?5.0 | 0.95?-?5.0 | CMOS | + 64 | 0.7 | 1 | low | -40~125 | 521 | 22.4 | 278 | X2SON6 | Bi-directional | AutoSense |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| LSF0101GM | LSF0101GMX (935690956115) |
Active | h1 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| LSF0101GW | LSF0101GWH (935690295125) |
Active | h1 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
| LSF0101GW-Q100 | LSF0101GW-Q100H (935691326125) |
Active | h1 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
| LSF0101GX | LSF0101GXZ (935690296147) |
Active | h1 |
X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 |
環境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| LSF0101GM | LSF0101GMX | LSF0101GM |
|
|
| LSF0101GW | LSF0101GWH | LSF0101GW |
|
|
| LSF0101GW-Q100 | LSF0101GW-Q100H | LSF0101GW-Q100 |
|
|
| LSF0101GX | LSF0101GXZ | LSF0101GX |
|
|
文檔 (14)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| LSF0101 | 1-bit bidirectional multi-voltage level translator; open-drain; push-pull | Data sheet | 2024-07-25 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
支持
如果您需要設計/技術支持，請告知我們并填寫 應答表 我們會盡快回復您。
Ordering, pricing & availability
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機構訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區分銷商網絡可為您提供 Nexperia 樣品支持。查看官方經銷商列表。