AXP1T34
Dual supply translating buffer
The AXP1T34 is a single bit, dual supply translating buffer. It features one input (A), an output (Y) and dual supply pins (VCCI and VCCO). Both VCCI and VCCO can be supplied at any voltage between 0.9 V and 5.5 V making the device suitable for translating between any voltage nodes specified (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). No power supply sequencing is required and output glitches during power supply transitions are prevented using patented circuitry. As a result, glitches will not appear on the outputs for supply transitions during power-up/down between 20 mV?/?μs and 5.5 V/s
The input is referenced to VCCI and the output is referenced to VCCO. Schmitt-trigger action at the input makes the circuit tolerant of slower input rise and fall times.
This device ensures low static and dynamic power consumption across the entire supply range and is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down. In suspend mode when either VCCI or VCCO are at GND level the output is in the high-impedance OFF-state
Features and benefits
Wide supply voltage range:
VCCI: 0.9 V to 5.5 V
VCCO: 0.9 V to 5.5 V
Low input capacitance; CI = 1.5 pF (typical)
Low output capacitance; CO = 3.8 pF (typical)
Low dynamic power consumption; CPD = 0.4 pF at VCCI = 1.2 V (typical)
Low dynamic power consumption; CPD = 11 pF at VCCO = 5 V (typical)
Low static power consumption; ICCI = 0.1 μA (25 °C maximum)
Low static power consumption; ICCO = 1.0 μA (25 °C maximum)
High noise immunity
Complies with JEDEC standard:
JESD8-12 (1.1 V to 1.3 V; A input)
JESD8-11 (1.4 V to 1.6 V)
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
JESD12-6 (4.5 V to 5.5 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Latch-up performance exceeds 100 mA per JESD78D Class II
Inputs accept voltages up to 5.5 V
Low noise overshoot and undershoot < 10% of VCCO
IOFF circuitry provides partial power-down mode operation
Multiple package options
Specified from ?40 °C to +125 °C
參數(shù)類(lèi)型
| 型號(hào) | Logic switching levels | Output drive capability (mA) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|
| AXP1T34GM | CMOS | ± 12 | 1 | ultra low | -40~125 | 304 | 7.3 | 153 | XSON6 |
| AXP1T34GS | CMOS | ± 12 | 1 | ultra low | -40~125 | 304 | 24 | 202 | XSON6 |
| AXP1T34GW | CMOS | ± 12 | 1 | ultra low | -40~125 | 300 | 72 | 172 | TSSOP5 |
| AXP1T34GX | CMOS | ± 12 | 1 | ultra low | -40~125 | 303 | 75 | 175 | X2SON5 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| AXP1T34GM | AXP1T34GMX (935691627115) |
Active | r3 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| AXP1T34GS | AXP1T34GSH (935691626125) |
Active | r3 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暫無(wú)信息 |
| AXP1T34GW | AXP1T34GWH (935691624125) |
Active | r3 |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| AXP1T34GX | AXP1T34GXH (935691573125) |
Active | r3 |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
|
74AXP1T34GM
|
74AXP1T34GMH (935306991125) |
Withdrawn / End-of-life | rQ |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
| 74AXP1T34GN | 74AXP1T34GNH (935306992125) |
Withdrawn / End-of-life | no package information | ||||
| 74AXP1T34GS | 74AXP1T34GSH (935306993125) |
Withdrawn / End-of-life | no package information | ||||
| 74AXP1T34GW | 74AXP1T34GWH (935306994125) |
Withdrawn / End-of-life |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 | |
|
74AXP1T34GX
|
74AXP1T34GXH (935306995125) |
Withdrawn / End-of-life |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 | ||
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| AXP1T34GM | AXP1T34GMX | AXP1T34GM |
|
|
| AXP1T34GS | AXP1T34GSH | AXP1T34GS |
|
|
| AXP1T34GW | AXP1T34GWH | AXP1T34GW |
|
|
| AXP1T34GX | AXP1T34GXH | AXP1T34GX |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
|
74AXP1T34GM
|
74AXP1T34GMH | 74AXP1T34GM |
|
|
| 74AXP1T34GN | 74AXP1T34GNH | 74AXP1T34GN |
|
|
| 74AXP1T34GS | 74AXP1T34GSH | 74AXP1T34GS |
|
|
| 74AXP1T34GW | 74AXP1T34GWH | 74AXP1T34GW |
|
|
|
74AXP1T34GX
|
74AXP1T34GXH | 74AXP1T34GX |
|
|
文檔 (20)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| AXP1T34 | Dual supply translating buffer | Data sheet | 2023-12-01 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
Ordering, pricing & availability
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