Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity
Leadless very small SMD plastic package with medium power capability
Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
Linear voltage regulators
High-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
參數類型
| 型號 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|
| BC51-10PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | PNP | 420 | -45 | -1000 | 63 | 160 | Y |
| BC51-16PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | PNP | 420 | -45 | -1000 | 100 | 250 | Y |
| BC51PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | PNP | 420 | -45 | -1000 | 63 | 250 | Y |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BC51-10PA-Q | BC51-10PA-QX (934666362115) |
Active | BQ |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC51-16PA-Q | BC51-16PA-QX (934666363115) |
Active | BR |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC51PA-Q | BC51PA-QX (934664897115) |
Active | BP |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
環境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BC51-10PA-Q | BC51-10PA-QX | BC51-10PA-Q |
|
|
| BC51-16PA-Q | BC51-16PA-QX | BC51-16PA-Q |
|
|
| BC51PA-Q | BC51PA-QX | BC51PA-Q |
|
|
文檔 (7)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| BC51PA-Q_SER | 45 V, 1 A PNP medium power transistors | Data sheet | 2023-10-16 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020-3_SOT1061_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
如果您需要設計/技術支持，請告知我們并填寫 應答表 我們會盡快回復您。
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
Ordering, pricing & availability
樣品
作為 Nexperia 的客戶，您可以通過我們的銷售機構訂購樣品。
如果您沒有 Nexperia 的直接賬戶，我們的全球和地區分銷商網絡可為您提供 Nexperia 樣品支持。查看官方經銷商列表。