74LVC1G240
Single inverting buffer/line driver; 3-state
The 74LVC1G240 is a 1??-??bit inverting buffer/line driver with 3?-?state output. The device features an output enable OE. A HIGH on OE causes the output to assume a high?-?impedance OFF?-?state. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.
Schmitt?-?trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
IOFF circuitry provides partial Power-down mode operation
±24 mA output drive (VCC = 3.0 V)
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
JESD36 (4.5 V to 5.5 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
- Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC1G240GM | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 313 | 7.7 | 158 | XSON6 |
| 74LVC1G240GS | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 325 | 218 | XSON6 | |
| 74LVC1G240GW | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 313 | 158 | TSSOP5 | |
| 74LVC1G240GX | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 1 | low | -40~125 | 327 | 195 | X2SON5 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC1G240GM | 74LVC1G240GM,115 (935277205115) |
Active | V2 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74LVC1G240GS | 74LVC1G240GSH (935691254125) |
Active | V2 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暫無信息 |
| 74LVC1G240GW | 74LVC1G240GWH (935691562125) |
Active | V2 |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74LVC1G240GX | 74LVC1G240GXH (935691255125) |
Active | V2 |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC1G240GM | 74LVC1G240GM,115 | 74LVC1G240GM |
|
|
| 74LVC1G240GS | 74LVC1G240GSH | 74LVC1G240GS |
|
|
| 74LVC1G240GW | 74LVC1G240GWH | 74LVC1G240GW |
|
|
| 74LVC1G240GX | 74LVC1G240GXH | 74LVC1G240GX |
|
|
文檔 (21)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC1G240 | Single inverting buffer/line driver; 3-state | Data sheet | 2023-11-01 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| lvc1g240 | 74LVC1G240 IBIS model | IBIS model | 2021-07-29 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| lvc1g240 | 74LVC1G240 IBIS model | IBIS model | 2021-07-29 |
Ordering, pricing & availability
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