BC55PA series
60 V, 1 A NPN medium power transistors
NPN medium power transistor in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package.
Type number | Package | NPN complement | |
|---|---|---|---|
Nexperia | JEITA | ||
BC55PA | SOT1061 | - | BC52PA |
BC55-10PA | BC52-10PA | ||
BC55-16PA | BC52-16PA | ||
Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity
Leadless very small SMD plastic package with medium power capability
AEC-Q101 qualified
Applications
Linear voltage regulators
Power management
Low-side switches
MOSFET drivers
Battery-driven devices
Amplifiers
參數類型
| 型號 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC55-10PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 60.0 | 1000.0 | 63.0 | 160.0 | 150 | 100.0 | Y |
| BC55-16PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 60.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 | Y |
| BC55PA | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 60.0 | 1000.0 | 63.0 | 250.0 | 150 | 100.0 | Y |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BC55-10PA | BC55-10PA,115 (934065807115) |
Active | BH |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC55-16PA | BC55-16PA,115 (934065808115) |
Active | BJ |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC55PA | BC55PA,115 (934065742115) |
Active | AW |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
文檔 (7)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| BC55PA_SER | 60 V, 1 A NPN medium power transistors | Data sheet | 2022-07-01 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020-3_SOT1061_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |