BC56PA-Q_SER single bipolar
80 V, 1 A NPN medium power transistors
NPN medium power transistor in a SOT1061 (DFN2020-3) leadless very small Surface-Mounted Device (SMD) plastic package.
Features and benefits
High collector current capability IC and ICM
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity
Leadless very small SMD plastic package with medium power capability
Qualified according to AEC-Q101 and recommended for use in automotive applications
Applications
Linear voltage regulators
MOSFET drivers
Low-side switches
Power management
Amplifiers
Battery-driven devices
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | hFE [max] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BC56-10PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 80.0 | 1000.0 | 63.0 | 160.0 | 150 | 100.0 | Y |
| BC56-16PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 80.0 | 1000.0 | 100.0 | 250.0 | 150 | 100.0 | Y |
| BC56PA-Q | SOT1061 | DFN2020-3 | 2 x 2 x 0.65 | NPN | 420.0 | 80.0 | 1000.0 | 63.0 | 250.0 | 150 | 100.0 | Y |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| BC56-10PA-Q | BC56-10PA-QX (934664529115) |
Active | BK |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC56-16PA-Q | BC56-16PA-QX (934664521115) |
Active | BL |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
| BC56PA-Q | BC56PA-QX (934664530115) |
Active | AZ |
DFN2020-3 (SOT1061) |
SOT1061 |
REFLOW_BG-BD-1
|
SOT1061_115 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| BC56-10PA-Q | BC56-10PA-QX | BC56-10PA-Q |
|
|
| BC56-16PA-Q | BC56-16PA-QX | BC56-16PA-Q |
|
|
| BC56PA-Q | BC56PA-QX | BC56PA-Q |
|
|
文檔 (6)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN2020-3_SOT1061_mk | plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
| SOT1061 | plastic, leadless thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-05-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
如果您需要設計/技術支持，請告知我們并填寫 應答表 我們會盡快回復您。
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT1061 | 3D model for products with SOT1061 package | Design support | 2022-06-02 |
Ordering, pricing & availability
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