PESDxL5UF; PESDxL5UV; PESDxL5UY
Low capacitance unidirectional fivefold ESD protection diode array
Low capacitance unidirectional fivefold ElectroStatic Discharge (ESD) protection diode array in a leadless ultra small XSON6 (SOT886) Surface-Mounted Device (SMD) plastic package, designed to protect up to five unidirectional signal lines from the damage caused by ESD and other transients.
Features and benefits
ESD protection of up to five lines
Low diode capacitance
Max. peak pulse power: PPPM = 25 W
Low clamping voltage: VCL = 12 V
Ultra low leakage current: IRM = 75 nA
ESD protection up to 20 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5 (surge); IPPM = 2.5 A
Application information
Computers and peripherals
Audio and video equipment
Cellular handsets and accessories
Communication systems
Portable electronics
SIM card protection
參數(shù)類型
| 型號 | Package name | Nr of lines | Configuration | VRWM (V) (V) | Cd [typ] (pF) | VESD IEC61000-4-2 (kV) |
|---|---|---|---|---|---|---|
| PESD3V3L5UF | XSON6 | 5 | Unidirectional | 3.3 | 22 | 20 |
| PESD3V3L5UY | TSSOP6 | 5 | Unidirectional | 3.3 | 22 | 20 |
| PESD5V0L5UF | XSON6 | 5 | Unidirectional | 5 | 16 | 20 |
| PESD5V0L5UV | SOT666 | 5 | Unidirectional | 5 | 16 | 15 |
| PESD5V0L5UY | TSSOP6 | 5 | Unidirectional | 5 | 16 | 20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PESD3V3L5UF | PESD3V3L5UF,115 (934061195115) |
Active | A1 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| PESD3V3L5UY | PESD3V3L5UY,115 (934057802115) |
Active | K3% |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_115 |
| PESD5V0L5UF | PESD5V0L5UF,115 (934061199115) |
Active | A2 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| PESD5V0L5UV | PESD5V0L5UV,115 (934057797115) |
Active | E2 |
(SOT666) |
SOT666 |
REFLOW_BG-BD-1
|
SOT666_115 |
| PESD5V0L5UV,125 (934057797125) |
Active | E2 | SOT666_125 | ||||
| PESD5V0L5UY | PESD5V0L5UY,115 (934057803115) |
Active | K4% |
TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_115 |
| PESD5V0L5UY,125 (934057803125) |
Active | K4% | SOT363_125 | ||||
| PESD5V0L5UYF (934057803135) |
Active | K4% | SOT363_135 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PESD3V3L5UV | PESD3V3L5UV/DG,115 (934062296115) |
Obsolete | no package information | ||||
| PESD3V3L5UV,115 (934057796115) |
Obsolete | ||||||
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PESD3V3L5UF | PESD3V3L5UF,115 | PESD3V3L5UF |
|
|
| PESD3V3L5UY | PESD3V3L5UY,115 | PESD3V3L5UY |
|
|
| PESD5V0L5UF | PESD5V0L5UF,115 | PESD5V0L5UF |
|
|
| PESD5V0L5UV | PESD5V0L5UV,115 | PESD5V0L5UV |
|
|
| PESD5V0L5UV | PESD5V0L5UV,125 | PESD5V0L5UV |
|
|
| PESD5V0L5UY | PESD5V0L5UY,115 | PESD5V0L5UY |
|
|
| PESD5V0L5UY | PESD5V0L5UY,125 | PESD5V0L5UY |
|
|
| PESD5V0L5UY | PESD5V0L5UYF | PESD5V0L5UY |
|
|
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PESD3V3L5UV | PESD3V3L5UV/DG,115 | PESD3V3L5UV |
|
|
| PESD3V3L5UV | PESD3V3L5UV,115 | PESD3V3L5UV |
|
|
文檔 (20)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PESDXL5UF_V_Y | Low capacitance unidirectional fivefold ESD protection diode arrays | Data sheet | 2020-05-01 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
| SOT666 | 3D model for products with SOT666 package | Design support | 2019-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
| SOT666_mk | plastic, surface-mounted package; 6 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
| SOT666 | plastic, surface-mounted package; 6 leads; 0.5 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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