74AXP1G97
Low-power configurable multiple function gate
The 74AXP1G97 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions MUX, AND, OR, NAND, NOR, inverter and buffer. All inputs can be connected directly to VCC or GND.
This device ensures very low static and dynamic power consumption across the entire VCC range from 0.7 V to 2.75 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.7 V to 2.75 V
Low input capacitance; CI = 0.5 pF (typical)
Low output capacitance; CO = 1.0 pF (typical)
Low dynamic power consumption; CPD = 2.6 pF at VCC = 1.2 V (typical)
Low static power consumption; ICC = 0.6 μA (85 °C maximum)
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 2.75 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial power-down mode operation
Complies with JEDEC standard:
JESD8-12A.01 (1.1 V to 1.3 V)
JESD8-11A.01 (1.4 V to 1.6 V)
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A.01 (2.3 V to 2.7 V)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2000 V
CDM JESD22-C101E exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C
參數類型
| 型號 |
|---|
封裝
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AXP1G97GM | 74AXP1G97GMH (935301603125) |
Withdrawn / End-of-life |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 | |
| 74AXP1G97GN | 74AXP1G97GNH (935301604125) |
Obsolete | no package information | ||||
| 74AXP1G97GS | 74AXP1G97GSH (935301605125) |
Obsolete | no package information | ||||
| 74AXP1G97GX | 74AXP1G97GXH (935307131125) |
Obsolete |
X2SON6 (SOT1255-2) |
SOT1255-2 | 暫無信息 | ||
| 74AXP1G97GXZ (935307131147) |
Withdrawn / End-of-life | SOT1255-2_147 | |||||
環境信息
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AXP1G97GM | 74AXP1G97GMH | 74AXP1G97GM |
|
|
| 74AXP1G97GN | 74AXP1G97GNH | 74AXP1G97GN |
|
|
| 74AXP1G97GS | 74AXP1G97GSH | 74AXP1G97GS |
|
|
| 74AXP1G97GX | 74AXP1G97GXH | 74AXP1G97GX |
|
|
| 74AXP1G97GX | 74AXP1G97GXZ | 74AXP1G97GX |
|
|
文檔 (15)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AXP1G97 | Low-power configurable multiple function gate | Data sheet | 2022-02-17 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
| Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
| Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812 | Single configurable logic | Leaflet | 2019-01-04 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
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