
74AUP2G132
Low-power dual 2-input NAND Schmitt trigger
The 74AUP2G132 is a dual 2-input NAND gate with Schmitt-trigger inputs. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
CMOS low power dissipation
High noise immunity
Low static power consumption; ICC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Overvoltage tolerant inputs to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
Applications
Wave and pulse shaper
Astable multivibrator
Monostable multivibrator
參數(shù)類型
型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|
74AUP2G132DC | 0.8?-?3.6 | CMOS | ± 1.9 | 10 | 70 | 2 | ultra low | -40~125 | 203 | 34.1 | 113 | VSSOP8 |
74AUP2G132GN | 0.8?-?3.6 | CMOS | ± 1.9 | 10 | 70 | 2 | ultra low | -40~125 | 238 | 10.6 | 148 | XSON8 |
74AUP2G132GS | 0.8?-?3.6 | CMOS | ± 1.9 | 10 | 70 | 2 | ultra low | -40~125 | 276 | 10.8 | 146 | XSON8 |
74AUP2G132GT | 0.8?-?3.6 | CMOS | ± 1.9 | 10 | 70 | 2 | ultra low | -40~125 | 327 | 6.1 | 157 | XSON8 |
74AUP2G132GX | 0.8?-?3.6 | CMOS | ± 1.9 | 10 | 70 | 2 | ultra low | -40~125 | X2SON8 |
封裝
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74AUP2G132DC | 74AUP2G132DC,125 (935280732125) |
Active | aE2 |
![]() VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
74AUP2G132GN | 74AUP2G132GN,115 (935292222115) |
Active | aE |
![]() XSON8 (SOT1116) |
SOT1116 |
REFLOW_BG-BD-1
|
SOT1116_115 |
74AUP2G132GS | 74AUP2G132GS,115 (935292377115) |
Active | aE |
![]() XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
74AUP2G132GT | 74AUP2G132GT,115 (935280733115) |
Active | aE2 |
![]() XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 | |
74AUP2G132GX | 74AUP2G132GXX (935339796115) |
Active | aE |
![]() X2SON8 (SOT1233-2) |
SOT1233-2 | SOT1233-2_115 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
74AUP2G132GD | 74AUP2G132GD,125 (935288327125) |
Obsolete | aE2 |
![]() XSON8 (SOT996-2) |
SOT996-2 | SOT996-2_125 | |
74AUP2G132GF | 74AUP2G132GF,115 (935291477115) |
Withdrawn / End-of-life |
![]() XSON8 (SOT1089) |
SOT1089 |
REFLOW_BG-BD-1
|
SOT1089_115 | |
74AUP2G132GM | 74AUP2G132GM,125 (935281435125) |
Obsolete | aE2 |
![]() XQFN8 (SOT902-2) |
SOT902-2 | SOT902-2_125 |
環(huán)境信息
型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AUP2G132DC | 74AUP2G132DC,125 | 74AUP2G132DC |
|
![]() |
74AUP2G132GN | 74AUP2G132GN,115 | 74AUP2G132GN |
|
![]() |
74AUP2G132GS | 74AUP2G132GS,115 | 74AUP2G132GS |
|
![]() |
74AUP2G132GT | 74AUP2G132GT,115 | 74AUP2G132GT |
|
![]() |
74AUP2G132GX | 74AUP2G132GXX | 74AUP2G132GX |
|
![]() |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AUP2G132GD | 74AUP2G132GD,125 | 74AUP2G132GD |
|
![]() |
74AUP2G132GF | 74AUP2G132GF,115 | 74AUP2G132GF |
|
![]() |
74AUP2G132GM | 74AUP2G132GM,125 | 74AUP2G132GM |
|
![]() |
文檔 (30)
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
74AUP2G132 | Low-power dual 2-input NAND Schmitt trigger | Data sheet | 2023-07-26 |
AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT1089 | 3D model for products with SOT1089 package | Design support | 2019-10-07 |
SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
SOT1233-2 | 3D model for products with SOT1233-2 package | Design support | 2021-01-28 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
XSON8_SOT1089_mk | plastic, extremely thin small outline package; no leads; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XQFN8_SOT902-2_mk | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
SOT996-2 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT1089 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.5 mm body | Package information | 2022-06-03 |
SOT902-2 | plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Package information | 2020-04-21 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
SOT1233-2 | plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mm | Package information | 2022-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1089 | MAR_SOT1089 Topmark | Top marking | 2013-06-03 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
如果您需要設(shè)計/技術(shù)支持,請告知我們并填寫 應(yīng)答表 我們會盡快回復(fù)您。
模型
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT1089 | 3D model for products with SOT1089 package | Design support | 2019-10-07 |
SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
SOT1233-2 | 3D model for products with SOT1233-2 package | Design support | 2021-01-28 |
Ordering, pricing & availability
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