74LVC3G17
Triple non-inverting Schmitt trigger with 5 V tolerant input
The 74LVC3G17 is a triple buffer with Schmitt-trigger inputs. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.65 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
±24 mA output drive (VCC = 3.0 V)
CMOS low-power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
IOFF circuitry provides partial Power-down mode operation
Complies with JEDEC standards
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
JESD36 (4.5 V to 5.5 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
Applications
Wave and pulse shapers for highly noisy environments
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC3G17DC | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 205 | 31.9 | 115 | VSSOP8 |
| 74LVC3G17DP | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 217 | 18.5 | 106 | TSSOP8 |
| 74LVC3G17GN | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 243 | 152 | XSON8 | |
| 74LVC3G17GS | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 281 | 149 | XSON8 | |
| 74LVC3G17GT | 1.65?-?5.5 | CMOS/LVTTL | ± 32 | 175 | 3 | low | -40~125 | 334 | 5.5 | 162 | XSON8 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC3G17DC | 74LVC3G17DC,125 (935275563125) |
Active | V17 |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
| 74LVC3G17DP | 74LVC3G17DP,125 (935275564125) |
Active | V17 |
TSSOP8 (SOT505-2) |
SOT505-2 | SOT505-2_125 | |
| 74LVC3G17GN | 74LVC3G17GN,115 (935292256115) |
Active | VV |
XSON8 (SOT1116) |
SOT1116 |
REFLOW_BG-BD-1
|
SOT1116_115 |
| 74LVC3G17GS | 74LVC3G17GS,115 (935292813115) |
Active | VV |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
| 74LVC3G17GT | 74LVC3G17GT,115 (935278935115) |
Active | V17 |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC3G17GD | 74LVC3G17GD,125 (935286864125) |
Obsolete | V17 |
XSON8 (SOT996-2) |
SOT996-2 | SOT996-2_125 | |
| 74LVC3G17GF | 74LVC3G17GF,115 (935291518115) |
Obsolete | no package information | ||||
| 74LVC3G17GM | 74LVC3G17GM,125 (935277249125) |
Obsolete |
XQFN8 (SOT902-2) |
SOT902-2 | SOT902-2_125 | ||
| 74LVC3G17GM,115 (935277249115) |
Obsolete | 暫無信息 | |||||
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC3G17DC | 74LVC3G17DC,125 | 74LVC3G17DC |
|
|
| 74LVC3G17DP | 74LVC3G17DP,125 | 74LVC3G17DP |
|
|
| 74LVC3G17GN | 74LVC3G17GN,115 | 74LVC3G17GN |
|
|
| 74LVC3G17GS | 74LVC3G17GS,115 | 74LVC3G17GS |
|
|
| 74LVC3G17GT | 74LVC3G17GT,115 | 74LVC3G17GT |
|
|
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC3G17GD | 74LVC3G17GD,125 | 74LVC3G17GD |
|
|
| 74LVC3G17GF | 74LVC3G17GF,115 | 74LVC3G17GF |
|
|
| 74LVC3G17GM | 74LVC3G17GM,125 | 74LVC3G17GM |
|
|
| 74LVC3G17GM | 74LVC3G17GM,115 | 74LVC3G17GM |
|
|
文檔 (29)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC3G17 | Triple non-inverting Schmitt trigger with 5 V tolerant input | Data sheet | 2023-08-24 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| 001aab107 | Block diagram: 74LVC3G17DC, 74LVC3G17DP, 74LVC3G17GM, 74LVC3G17GT | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| lvc3g17 | 74LVC3G17 IBIS model | IBIS model | 2015-01-15 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| XQFN8_SOT902-2_mk | plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
| SOT505-2 | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-03 |
| SOT996-2 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT902-2 | plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
| SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
| MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT505-2 | 3D model for products with SOT505-2 package | Design support | 2019-01-18 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| lvc3g17 | 74LVC3G17 IBIS model | IBIS model | 2015-01-15 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
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