Features and benefits
Low diode capacitance
Low forward voltage
Very small SMD plastic packages
AEC-Q101 qualified
Applications
Digital applications:
Ultra high-speed switching
Clamping circuits
RF applications:
Diode ring mixer
RF detector
RF voltage doubler
參數類型
型號 |
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封裝
下表中的所有產品型號均已停產 。
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
1PS88SB82 | 1PS88SB82,165 (934056580165) |
Obsolete | E1% |
![]() TSSOP6 (SOT363) |
SOT363 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT363_165 |
1PS88SB82,115 (934056580115) |
Withdrawn / End-of-life | E1% | SOT363_115 |
文檔 (11)
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
1PS66SB82_1PS88SB82 | 15 V, 30 mA low Cd Schottky barrier diodes | Data sheet | 2018-08-28 |
AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |