74AUP3G17
Low-power triple Schmitt trigger
The 74AUP3G17 provides three Schmitt trigger buffers. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
The inputs switch at different points for positive and negative-going signals. The difference between the positive voltage VT+ and the negative voltage VT- is defined as the input hysteresis voltage VH.
Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Low static power consumption; ICC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP3G17DC | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | 203 | 30.4 | 113 | VSSOP8 |
| 74AUP3G17GN | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | 238 | 148 | XSON8 | |
| 74AUP3G17GS | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | 276 | 146 | XSON8 | |
| 74AUP3G17GT | 0.8?-?3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | 327 | 5 | 157 | XSON8 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP3G17DC | 74AUP3G17DCH (935280697125) |
Active | pV |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
| 74AUP3G17GN | 74AUP3G17GNX (935307192115) |
Active | pV |
XSON8 (SOT1116) |
SOT1116 |
REFLOW_BG-BD-1
|
SOT1116_115 |
| 74AUP3G17GS | 74AUP3G17GSX (935307193115) |
Active | pV |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
| 74AUP3G17GT | 74AUP3G17GTX (935280696115) |
Active | pV |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 |
環境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP3G17DC | 74AUP3G17DCH | 74AUP3G17DC |
|
|
| 74AUP3G17GN | 74AUP3G17GNX | 74AUP3G17GN |
|
|
| 74AUP3G17GS | 74AUP3G17GSX | 74AUP3G17GS |
|
|
| 74AUP3G17GT | 74AUP3G17GTX | 74AUP3G17GT |
|
|
文檔 (20)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74AUP3G17 | Low-power triple Schmitt trigger | Data sheet | 2023-07-31 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
| XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
| SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
| SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
| SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
| SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
| MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
| SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
| SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
| SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
Ordering, pricing & availability
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