74LV4066
Quad bilateral switches
The 74LV4066 is a quad single pole, single throw analog switch. Each switch features two input?/?output terminals (nY and nZ) and an active HIGH enable input (nE). When nE is LOW, the analog switch is turned off. Digital inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess VCC.
Features and benefits
Wide supply voltage range from 1.0 to 6.0 V
CMOS low power dissipation
Direct interface with TTL levels
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
JESD36 (4.5 V to 5.5 V)
Typical VOLP (output ground bounce): < 0.8 V at VCC = 3.3 V and Tamb = 25 °C
Very low ON-resistance:
60 Ω (typical) at VCC = 2.0 V
35 Ω (typical) at VCC = 3.0 V
25 Ω (typical) at VCC = 4.5 V
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +80 °C and from -40 °C to +125 °C
參數類型
| 型號 | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LV4066D | SPST-NO | 1.0?-?6.0 | TTL | 50 | 3 | 180 | 0.02 | -60 | very low | -40~125 | 102 | 15.9 | 60 | SO14 |
| 74LV4066PW | SPST-NO | 1.0?-?6.0 | TTL | 50 | 3 | 180 | 0.02 | -60 | very low | -40~125 | 117 | 1 | 40.3 | TSSOP14 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LV4066D | 74LV4066D,118 (935088370118) |
Active | 74LV4066D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74LV4066PW | 74LV4066PW,118 (935175010118) |
Active | LV4066 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LV4066DB | 74LV4066DB,112 (935170200112) |
Obsolete | no package information | ||||
| 74LV4066DB,118 (935170200118) |
Obsolete | ||||||
環境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LV4066D | 74LV4066D,118 | 74LV4066D |
|
|
| 74LV4066PW | 74LV4066PW,118 | 74LV4066PW |
|
|
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LV4066DB | 74LV4066DB,112 | 74LV4066DB |
|
|
| 74LV4066DB | 74LV4066DB,118 | 74LV4066DB |
|
|
文檔 (15)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74LV4066 | Quad bilateral switches | Data sheet | 2024-04-08 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| sv01670 | Block diagram: 74LV4066D, 74LV4066DB, 74LV4066N, 74LV4066PW | Block diagram | 2009-11-04 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| lv | lv Spice model | SPICE model | 2013-05-07 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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