74HC173; 74HCT173
Quad D-type flip-flop; positive-edge trigger; 3-state
The 74HC173; 74HCT173 is a quad positive-edge triggered D-type flip-flop. The device features clock (CP), master reset (MR), two input enable (E1, E2) and two output enable (OE1, OE2) inputs. When the input enables are LOW, the outputs Qn will assume the state of their corresponding Dn inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A HIGH on either input enable will cause the device to go into a hold mode, outputs hold their previous state independently of clock and data inputs. A HIGH on MR forces the outputs LOW independently of clock and data inputs. A HIGH on either output enable pin causes the outputs to assume a high-impedance OFF-state. Operation of the output enable inputs does not affect the state of the flip-flops. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
Features and benefits
Complies with JEDEC standard no. 7A
Input levels:
For 74HC173: CMOS level
For 74HCT173: TTL level
Gated input enable for hold (do nothing) mode
Gated output enable control mode
Edge-triggered D-type register
Asynchronous master reset
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC173D | 2.0?-?6.0 | CMOS | ± 7.8 | 17 | 88 | low | -40~125 | 72 | 1 | 30 | SO16 |
| 74HC173PW | 2.0?-?6.0 | CMOS | ± 7.8 | 17 | 88 | low | -40~125 | 107 | 1 | 33.8 | TSSOP16 |
| 74HCT173D | 4.5?-?5.5 | TTL | ± 6 | 17 | 88 | low | -40~125 | 72 | 1 | 30 | SO16 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC173D | 74HC173D,653 (933714560653) |
Active | 74HC173D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
暫無信息 |
| 74HC173PW | 74HC173PW,118 (935189550118) |
Active | HC173 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT173D | 74HCT173D,653 (933715040653) |
Active | 74HCT173D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
暫無信息 |
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC173DB | 74HC173DB,112 (935189250112) |
Obsolete | HC173 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| 74HC173DB,118 (935189250118) |
Obsolete | HC173 | 暫無信息 | ||||
| 74HCT173DB | 74HCT173DB,112 (935189710112) |
Obsolete | HCT173 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無信息 |
| 74HCT173DB,118 (935189710118) |
Obsolete | HCT173 | 暫無信息 |
環境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC173D | 74HC173D,653 | 74HC173D |
|
|
| 74HC173PW | 74HC173PW,118 | 74HC173PW |
|
|
| 74HCT173D | 74HCT173D,653 | 74HCT173D |
|
|
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC173DB | 74HC173DB,112 | 74HC173DB |
|
|
| 74HC173DB | 74HC173DB,118 | 74HC173DB |
|
|
| 74HCT173DB | 74HCT173DB,112 | 74HCT173DB |
|
|
| 74HCT173DB | 74HCT173DB,118 | 74HCT173DB |
|
|
文檔 (18)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT173 | Quad D-type flip-flop; positive-edge trigger; 3-state | Data sheet | 2024-01-15 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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