74HCS166-Q100
8-bit parallel-in/serial out shift register with Schmitt-trigger inputs
The 74HCS166-Q100 is an 8-bit serial or parallel-in/serial-out shift register. The device features a serial data input (DS), eight parallel data inputs (D0 to D7) and a serial output (Q7). When the parallel enable input (PE) is LOW, the data from D0 to D7 is loaded into the shift register on the next LOW?-?to?-?HIGH transition of the clock input (CP). WhenPE is HIGH, data enters the register serially at DS with each LOW-to-HIGH transition of CP. When the clock enable input (CE) is LOW data is shifted on the LOW-to-HIGH transitions of CP. A HIGH on CE disables the CP input. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
- Schmitt-trigger inputs
- Low power consumption
- Typical supply current (ICC) of 100 nA
- Typical input leakage current (II) of ±10 nA
- ±7.8 mA output drive at 6 V
8-bit serial input and 8-bit serial or parallel output
Storage register with 3-state outputs
Shift register with direct clear
- Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Complies with JEDEC standards:
- JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V
CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74HCS166BQ-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 7 | 220 | low | -40~125 | DHVQFN16 |
| 74HCS166D-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 7 | 220 | low | -40~125 | SO16 |
| 74HCS166PW-Q100 | 2.0?-?6.0 | CMOS | ± 7.8 | 7 | 220 | low | -40~125 | TSSOP16 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HCS166BQ-Q100 | 74HCS166BQ-Q100X (935691474115) |
Active | HCS166 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HCS166D-Q100 | 74HCS166D-Q100J (935691899118) |
Active | 74HCS166D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HCS166PW-Q100 | 74HCS166PW-Q100J (935691477118) |
Active | HCS166 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HCS166BQ-Q100 | 74HCS166BQ-Q100X | 74HCS166BQ-Q100 |
|
|
| 74HCS166D-Q100 | 74HCS166D-Q100J | 74HCS166D-Q100 |
|
|
| 74HCS166PW-Q100 | 74HCS166PW-Q100J | 74HCS166PW-Q100 |
|
|
文檔 (17)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HCS166_Q100 | 8-bit parallel-in/serial out shift register with Schmitt-trigger inputs | Data sheet | 2025-06-18 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| 74hcs166 | 74HCS166 IBIS Model | IBIS model | 2025-06-30 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| 74hcs166 | 74HCS166 IBIS Model | IBIS model | 2025-06-30 |
Ordering, pricing & availability
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