74CBTLV3384
10-bit bus switch with 5-bit output enables
The 74CBTLV3384 is a dual 5-pole, single-throw bus switch. The device features two output enable inputs (nOE) that each control five switch channels. The switches are disabled when the associated nOE input is HIGH. Schmitt-trigger action at control inputs makes the circuit tolerant of slower input rise and fall times. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
Supply voltage range from 2.3 V to 3.6 V
High noise immunity
5 Ω switch connection between two ports
Rail to rail switching on data I/O ports
CMOS low power consumption
Latch-up performance exceeds 250 mA per JESD78B Class I level A
IOFF circuitry provides partial Power-down mode operation
Complies with JEDEC standard:
JESD8-5 (2.3 V to 2.7 V)
JESD8-B/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類型
| 型號(hào) | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74CBTLV3384BQ | 2.3?-?3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 10 | 0.2 | very low | -40~125 | 72 | 7.6 | 45 | DHVQFN24 |
| 74CBTLV3384PW | 2.3?-?3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 10 | 0.2 | very low | -40~125 | 82 | 2.5 | 37 | TSSOP24 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74CBTLV3384BQ | 74CBTLV3384BQ,118 (935294083118) |
Active | BTLV3384 |
DHVQFN24 (SOT815-1) |
SOT815-1 | SOT815-1_118 | |
| 74CBTLV3384PW | 74CBTLV3384PW,118 (935294085118) |
Active | CBTLV3384 |
TSSOP24 (SOT355-1) |
SOT355-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT355-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74CBTLV3384BQ | 74CBTLV3384BQ,118 | 74CBTLV3384BQ |
|
|
| 74CBTLV3384PW | 74CBTLV3384PW,118 | 74CBTLV3384PW |
|
|
文檔 (10)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74CBTLV3384 | 10-bit bus switch with 5-bit output enables | Data sheet | 2024-06-24 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT815-1 | 3D model for products with SOT815-1 package | Design support | 2019-10-03 |
| SOT355-1 | 3D model for products with SOT355-1 package | Design support | 2020-01-22 |
| cbtlv3384 | 74CBTLV3384 IBIS Model | IBIS model | 2013-11-11 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN24_SOT815-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 3.5 mm x 5.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | Package information | 2021-08-17 |
| SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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