74AUP1T57
Low-power configurable gate with voltage-level translator
The 74AUP1T57 is a configurable multiple function gate with level translating, Schmitt-trigger inputs. The device can be configured as any of the following logic functions AND, OR, NAND, NOR, XNOR, inverter and buffer; using the 3-bit input. All inputs can be connected directly to VCC or GND. Low threshold Schmitt trigger inputs allow these devices to be driven by 1.8 V logic levels in 3.3 V applications.
This device ensures very low static and dynamic power consumption across the entire VCC range from 2.3 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 2.3 V to 3.6 V
High noise immunity
Low static power consumption; ICC = 1.5 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Overvoltage tolerant inputs to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial power-down mode operation
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
參數(shù)類型
| 型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP1T57GM | 2.3?-?3.6 | n.a. | CMOS | ± 4 | 3.9 | 1 | ultra low | -40~125 | 290 | 6.5 | 145 | XSON6 | Uni-directional | Schmitt-trigger |
| 74AUP1T57GN | 2.3?-?3.6 | n.a. | CMOS | ± 4 | 3.9 | 1 | ultra low | -40~125 | 275 | 11.7 | 171 | XSON6 | Uni-directional | Schmitt-trigger |
| 74AUP1T57GS | 2.3?-?3.6 | n.a. | CMOS | ± 4 | 3.9 | 1 | ultra low | -40~125 | 272 | 14.8 | 177 | XSON6 | Uni-directional | Schmitt-trigger |
| 74AUP1T57GW | 2.3?-?3.6 | n.a. | CMOS | ± 4 | 3.9 | 1 | ultra low | -40~125 | 264 | 38.6 | 153 | TSSOP6 | Uni-directional | Schmitt-trigger |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP1T57GM | 74AUP1T57GM,115 (935280465115) |
Active | a7 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| 74AUP1T57GM,132 (935280465132) |
Active | a7 | SOT886_132 | ||||
| 74AUP1T57GN | 74AUP1T57GN,132 (935291754132) |
Active | a7 |
XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
| 74AUP1T57GS | 74AUP1T57GS,132 (935292878132) |
Active | a7 |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
| 74AUP1T57GW | 74AUP1T57GW,125 (935280464125) |
Active | a7 |
TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP1T57GF | 74AUP1T57GF,132 (935281364132) |
Withdrawn / End-of-life |
XSON6 (SOT891) |
SOT891 |
REFLOW_BG-BD-1
|
SOT891_132 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP1T57GM | 74AUP1T57GM,115 | 74AUP1T57GM |
|
|
| 74AUP1T57GM | 74AUP1T57GM,132 | 74AUP1T57GM |
|
|
| 74AUP1T57GN | 74AUP1T57GN,132 | 74AUP1T57GN |
|
|
| 74AUP1T57GS | 74AUP1T57GS,132 | 74AUP1T57GS |
|
|
| 74AUP1T57GW | 74AUP1T57GW,125 | 74AUP1T57GW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP1T57GF | 74AUP1T57GF,132 | 74AUP1T57GF |
|
|
文檔 (27)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AUP1T57 | Low-power configurable gate with voltage-level translator | Data sheet | 2023-07-26 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| 001aab583 | Block diagram: 74AUP1G57GF, 74AUP1G57GM, 74AUP1G57GW, 74AUP1T57GF, 74AUP1T57GM, 74AUP1T57GW, 74LVC1G57GF, 74LVC1G57GM, 74LVC1G57GV, 74LVC1G57GW | Block diagram | 2009-11-03 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| aup1t57 | aup1t57 IBIS model | IBIS model | 2014-12-21 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1010-6_SOT891_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| SOT891 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1 mm x 0.5 mm body | Package information | 2020-04-21 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT891 | MAR_SOT891 Topmark | Top marking | 2013-06-03 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT891 | 3D model for products with SOT891 package | Design support | 2019-10-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
| aup1t57 | aup1t57 IBIS model | IBIS model | 2014-12-21 |
Ordering, pricing & availability
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