74ALVCH16373
2.5 V/3.3 V 16-bit D-type transparent latch; 3-state
The 74ALVCH16373 is a 16-bit D-type transparent latch with bus hold inputs and 3-state outputs. The device can be used as two 8-bit transparent latches or a single 16-bit transparent latch. The device features two latch enables (1LE and 2LE) and two output enables (1OE and 2OE), each controlling 8-bits. When nLE is HIGH, data at the inputs enter the latches. In this condition the latches are transparent, a latch output will change each time its corresponding D-input changes. When nLE is LOW the latches store the information that was present at the inputs a set-up time preceding the HIGH-to-LOW transition of nLE. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state. Operation of the nOE input does not affect the state of the latches.
This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power dissipation
MULTIBYTE? flow-through standard pin-out architecture
Low inductance multiple VCC and GND pins for minimum noise and ground bounce
Direct interface with TTL levels
All data inputs have bus hold
Latch-up performance exceeds 100 mA per JESD78 Class II.A
Output drive capability 50 ? transmission lines at 85 °C
Current drive ±24 mA at VCC = 3.0 V
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Complies with JEDEC standards:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C/JESD36 (2.7 V to 3.6 V)
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74ALVCH16373DGG | 2.3?-?3.6 | LVTTL | ± 24 | 2.1 | low | -40~85 | 82 | 1.8 | 35 | TSSOP48 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ALVCH16373DGG | 74ALVCH16373DGG:11 (935205120118) |
Active | ALVCH16373 |
TSSOP48 (SOT362-1) |
SOT362-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT362-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74ALVCH16373DL | 74ALVCH16373DL,112 (935260443112) |
Obsolete | ALVCH16373 Standard Procedure Standard Procedure |
SSOP48 (SOT370-1) |
SOT370-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無(wú)信息 |
| 74ALVCH16373DL,118 (935260443118) |
Obsolete | ALVCH16373 Standard Procedure Standard Procedure | SOT370-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74ALVCH16373DGG | 74ALVCH16373DGG:11 | 74ALVCH16373DGG |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74ALVCH16373DL | 74ALVCH16373DL,112 | 74ALVCH16373DL |
|
|
| 74ALVCH16373DL | 74ALVCH16373DL,118 | 74ALVCH16373DL |
|
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文檔 (11)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74ALVCH16373 | 2.5 V/3.3 V 16-bit D-type transparent latch; 3-state | Data sheet | 2024-06-18 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| sw00068 | Block diagram: 74ALVCH16373DGG, 74ALVCH16373DL | Block diagram | 2009-11-04 |
| SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
| alvch16373 | alvch16373 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP48_SOT362-1_mk | plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body | Marcom graphics | 2017-01-28 |
| SOT362-1 | plastic thin shrink small outline package; 48 leads; body width 6.1 mm | Package information | 2024-01-05 |
| SOT370-1 | plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT362-1 | 3D model for products with SOT362-1 package | Design support | 2020-01-22 |
| alvch16373 | alvch16373 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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