PESDxUSB3S
ESD protection for differential data lines
The devices are ElectroStatic Discharge (ESD) protection devices for one, two or three differential channels.
The PESDxUSB3S is footprint compatible to PCMFxUSB3S.
The devices provide protection to downstream components from ESD voltages up to ±15 kV on each signal line.
Type number | Number of channels | Package Name |
|---|---|---|
PESD1USB3S | 1 | WLCSP5 |
PESD2USB3S | 2 | WLCSP10 |
PESD3USB3S | 3 | WLCSP15 |
Features and benefits
Allows replacement between PCMFxUSB3S common-mode filters with ESD protection and PESDxUSB3S ESD protection in the same footprint
TrEOS protection process for very high system-level ESD robustness: superior protection of sensitive SoCs
ESD protection for one, two and three differential channels up to ±15 kV contact discharge according to IEC 61000-4-2
Industry-standard WLCSP5, 10 and 15 packages for smallest footprint
Applications
Smartphone, cellular and cordless phone
USB3.1, USB2.0, HDMI2.0, HDMI1.4
General-purpose downstream ESD protection
Tablet PC and Mobile Internet Device (MID)
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
參數(shù)類型
| 型號 | Package version | Package name | Size (mm) | Configuration | Nr of lines | VRWM (V) (V) | Cd [typ] (pF) | IPPM [max] (A) | VESD (kV) (kV) |
|---|---|---|---|---|---|---|---|---|---|
| PESD1USB3S | WLCSP5_2-1-2 | WLCSP5 | 0.77 x 1.17 x 0.57 | Unidirectional | 2 | 5 | 0.45 | 8 | 15 |
| PESD2USB3S | WLCSP10_4-2-4 | WLCSP10 | 1.57 x 1.17 x 0.57 | Unidirectional | 4 | - | 0.45 | 8 | 15 |
| PESD3USB3S | WLCSP15_6-3-6 | WLCSP15 | 2.37 x 1.17 x 0.57 | Unidirectional | 6 | 5 | 0.45 | 8 | 15 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PESD1USB3S | PESD1USB3S/CZ (934660289087) |
Active |
WLCSP5 (WLCSP5_2-1-2) |
WLCSP5_2-1-2 | 暫無信息 | ||
| PESD1USB3SZ (934069683087) |
Active | 暫無信息 | |||||
| PESD2USB3S | PESD2USB3S/CZ (934660291087) |
Active |
WLCSP10 (WLCSP10_4-2-4) |
WLCSP10_4-2-4 | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | ||
| PESD2USB3SZ (934069684087) |
Active | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | |||||
| PESD3USB3S | PESD3USB3S/CZ (934660292087) |
Active |
WLCSP15 (WLCSP15_6-3-6) |
WLCSP15_6-3-6 | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 | ||
| PESD3USB3SZ (934069685087) |
Active | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PESD3USB3S | PESD3USB3S/CX (934660292115) |
Withdrawn / End-of-life |
WLCSP15 (WLCSP15_6-3-6) |
WLCSP15_6-3-6 | 暫無信息 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PESD1USB3S | PESD1USB3S/CZ | PESD1USB3S |
|
|
| PESD1USB3S | PESD1USB3SZ | PESD1USB3S |
|
|
| PESD2USB3S | PESD2USB3S/CZ | PESD2USB3S |
|
|
| PESD2USB3S | PESD2USB3SZ | PESD2USB3S |
|
|
| PESD3USB3S | PESD3USB3S/CZ | PESD3USB3S |
|
|
| PESD3USB3S | PESD3USB3SZ | PESD3USB3S |
|
|
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PESD3USB3S | PESD3USB3S/CX | PESD3USB3S |
|
|
文檔 (10)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PESDXUSB3S_SER | ESD protection for differential data lines | Data sheet | 2019-01-30 |
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
| WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
| WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP15_6-3-6 | wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
Ordering, pricing & availability
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