PESD3V3S4UF; PESD5V0S4UF
Unidirectional quadruple ESD protection diode arrays
Unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in a small SOT886 Surface-Mounted Device (SMD) plastic package designed to protect up to four signal lines from the damage caused by ESD and other transients.
Features and benefits
ESD protection of up to four lines
ESD protection up to 30 kV
Max. peak pulse power: PPP = 110 W
IEC 61000-4-2; level 4 (ESD)
Low clamping voltage: VCL = 11 V
IEC 61000-4-5 (surge); IPP = 10 A
Ultra low leakage current: IRM = 4 nA
AEC-Q101 qualified
Applications
Computers and peripherals
Communication systems
Audio and video equipment
Portable electronics
Cellular handsets and accessories
參數(shù)類型
| 型號(hào) | Package name | Nr of lines | Configuration | VRWM (V) (V) | Cd [typ] (pF) | VESD IEC61000-4-2 (kV) |
|---|---|---|---|---|---|---|
| PESD3V3S4UF | XSON6 | 4 | Unidirectional | 3.3 | 110 | 30 |
| PESD5V0S4UF | XSON6 | 4 | Unidirectional | 5 | 85 | 30 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PESD3V3S4UF | PESD3V3S4UF,115 (934061196115) |
Active | A3 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| PESD5V0S4UF | PESD5V0S4UF,115 (934061201115) |
Active | A4 |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PESD3V3S4UF | PESD3V3S4UF,115 | PESD3V3S4UF |
|
|
| PESD5V0S4UF | PESD5V0S4UF,115 | PESD5V0S4UF |
|
|
文檔 (12)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| PESD3V3S4UF_PESD5V0S4UF | Unidirectional quadruple ESD protection diode arrays | Data sheet | 2020-04-28 |
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| 006aaa156 | Block diagram: PESD12VS4UD, PESD15VS4UD, PESD24VS4UD, PESD3V3S4UD, PESD3V3S4UF, PESD5V0S4UD, PESD5V0S4UF | Block diagram | 2009-11-04 |
| sot886_fr | Reflow soldering footprint SOT886 | Block diagram | 2009-11-04 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
支持
如果您需要設(shè)計(jì)/技術(shù)支持，請(qǐng)告知我們并填寫 應(yīng)答表 我們會(huì)盡快回復(fù)您。
模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
Ordering, pricing & availability
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