
CBT3306-Q100
Dual bus switch
The CBT3306-Q100 dual FET bus switch features independent line switches. Each switch is disabled when the associated output enable (nOE) input is HIGH.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 3) and is suitable for use in automotive applications.
Features and benefits
- Automotive product qualification in accordance with AEC-Q100 (Grade 3)
- Specified from -40 °C to +85 °C
- 5 Ω switch connection between two ports
- TTL-compatible input levels
- Latch-up protection exceeds 100 mA per JESD78B
- ESD protection:
- MIL-STD-883, method 3015 exceeds 2000 V
- HBM JESD22-A114F exceeds 2000 V
Applications
參數類型
型號 |
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封裝
下表中的所有產品型號均已停產 。
型號 | 可訂購的器件編號,(訂購碼(12NC)) | 狀態 | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
---|---|---|---|---|---|---|---|
CBT3306D-Q100 | CBT3306D-Q100J (935300475118) |
Obsolete | CBT3306 |
![]() SO8 (SOT96-1) |
SOT96-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT96-1_118 |
CBT3306PW-Q100 | CBT3306PW-Q100J (935300476118) |
Obsolete | 3306 |
![]() TSSOP8 (SOT530-1) |
SOT530-1 | SOT530-1_118 |
環境信息
下表中的所有產品型號均已停產 。
型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
---|---|---|---|---|
CBT3306D-Q100 | CBT3306D-Q100J | CBT3306D-Q100 |
|
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CBT3306PW-Q100 | CBT3306PW-Q100J | CBT3306PW-Q100 |
|
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文檔 (12)
文件名稱 | 標題 | 類型 | 日期 |
---|---|---|---|
CBT3306_Q100 | Dual bus switch | Data sheet | 2019-03-06 |
AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
SOT530-1 | 3D model for products with SOT530-1 package | Design support | 2023-02-07 |
cbt3306 | cbt3306 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO8_SOT96-1_mk | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
SOT96-1 | plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body | Package information | 2020-04-21 |
SOT530-1 | plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-03 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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Ordering, pricing & availability
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