化學成分 SMDJ7.0CA

作為一家積極進取的可持續發展公司，安世半導體已決定直接通過互聯網發布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協助他們進行RoHS指令或無鉛狀態合規評估。客戶可以直接從一般產品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業設下的一個行業標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934668684118	SMDJ7.0CAJ	SMDJ7.0CA	SOD1003-1 (SMC)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 30501 ppm of the article. SCIP No. 2b34f063-86fa-4901-a594-45179d504748.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'; using exemption 7(c)-I: 'Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.'.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS); using exemption 8.1: '高熔點焊料 (如鉛含量超過85%（重量百分比）的鉛基合金焊料）'; using exemption 8.3.1: '陶瓷及玻璃：用于除介電陶瓷電容以外的電子電氣元器件 (例如，壓電器件、玻璃和陶瓷的復合材料）'.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'; using exemption 10(a): 'Electrical and electronic components, which contain lead in a glass or ceramic, in a glass or ceramic matrix compound, in a glass-ceramic material, or in a glass-ceramic matrix compound.'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 2398 ppm; substance 65997-17-3: 211 ppm; substance 1333-86-4: 6344 ppm; substance 7439-92-1: 30501 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 2398 ppm; substance 65997-17-3: 211 ppm; substance 1333-86-4: 6344 ppm; substance 7439-92-1: 30501 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 824 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	11.022640	90.178190	3.814062
Die	Pure metal layer	Nickel (Ni)	7440-02-0	0.693050	5.669980	0.239810
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.243220	1.989850	0.084159
Die	Pure metal layer	Titanium (Ti)	7440-32-6	0.203170	1.662150	0.070301
Die	Lead borosilicate glass	Lead borosilicate glass (generic)	65997-17-3	0.061090	0.499830	0.021138
		Die Total		12.223170	100.000000	4.229470

Clip	Copper alloy	Copper (Cu)	7440-50-8	38.283220	99.888020	13.246789
Clip	Copper alloy	Iron (Fe)	7439-89-6	0.032200	0.084000	0.011142
Clip	Copper alloy	Phosphorus (P)	7723-14-0	0.010720	0.027980	0.003709
		Clip Total		38.326140	100.000000	13.261640

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	43.456640	99.888060	15.036899
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.036530	0.083970	0.012640
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.012170	0.027970	0.004211
		Lead Frame Total		43.505340	100.000000	15.053750

Mould Compound	Filler	Silica fused	60676-86-0	159.509330	87.000030	55.193538
Mould Compound	Polymer	Phenolic resin		5.500310	2.999990	1.903221
Mould Compound	Filler	Silica	7631-86-9	5.500310	2.999990	1.903221
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	5.500310	2.999990	1.903222
Mould Compound	Polymer	Epoxy resin system		5.500300	3.000000	1.903218
Mould Compound	Filler	Carbon black	1333-86-4	1.833440	1.000000	0.634408
		Mould Compound Total		183.344000	100.000000	63.440828

Post-Plating	Pure metal layer	Tin (Sn)	7440-31-5	2.071670	100.000000	0.716841
		Post-Plating Total		2.071670	100.000000	0.716841

Solder Paste	Tin solder	Lead (Pb)	7439-92-1	8.814990	92.500310	3.050170
Solder Paste	Tin solder	Tin (Sn)	7440-31-5	0.476480	4.999890	0.164872
Solder Paste	Tin solder	Silver (Ag)	7440-22-4	0.238220	2.499800	0.082429
		Solder Paste Total		9.529690	100.000000	3.297471

		SMDJ7.0CA Total		289.000010		100.000000

Notes
Report created on 2025-09-08 08:50:03 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-09-08 08:50:03 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯苯 (PBB)	多溴二苯醚 (PBDE)
半導體芯片 (Die)	?	?	?	?	?	?
夾子 (Clip)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
錫膏 (Solder Paste)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	該半導體產品的環保使用期限（EFUP）為50年。 This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

Notes
Report created on 2025-09-08 08:50:03 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 SMDJ7.0CA

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 SMDJ7.0CA