化學成分 PESD5V0H1BLL-Q

作為一家積極進取的可持續發展公司，安世半導體已決定直接通過互聯網發布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協助他們進行RoHS指令或無鉛狀態合規評估?？蛻艨梢灾苯訌囊话惝a品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業設下的一個行業標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934665922303	PESD5V0H1BLL-QZ	PESD5V0H1BLL-Q	SOD882L-1 (DFN1006L-2)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 733 ppm; substance 7440-02-0: 175 ppm; substance 65997-17-3: 105153 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 733 ppm; substance 7440-02-0: 175 ppm; substance 75980-60-8: 4 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 50 ppm; substance 7440-57-5: 1148 ppm; substance 7440-05-3: 4275 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	0.044066	43.380000	7.313507
Die	Additive	Quartz (SiO2)	14808-60-7	0.003505	3.450000	0.581715
Die	Additive	Non-declarable		0.001606	1.580000	0.266543
		Semiconductor Substrate Total		0.049177	48.410000	8.161765
Die	Pure metal layer	Copper (Cu)	7440-50-8	0.040530	39.900000	6.726647
		Under Bump Metallization 1 Total		0.040530	39.900000	6.726647
Die	Pure metal layer	Titanium (Ti)	7440-32-6	0.005099	5.020000	0.846267
		Under Bump Metallization 2 Total		0.005099	5.020000	0.846267
Die	Pure metal	Copper (Cu)	7440-50-8	0.004053	3.990000	0.672665
		Bumping 1 Total		0.004053	3.990000	0.672665
Die	Tin alloy	Tin (Sn)	7440-31-5	0.001635	1.610000	0.271356
Die	Tin alloy	Silver (Ag)	7440-22-4	0.000030	0.030000	0.004979
		Bumping 2 Total		0.001665	1.640000	0.276335
Die	Polymer	Polyimide resin		0.001056	1.040000	0.175261
		Passivation Total		0.001056	1.040000	0.175261
		Die Total		0.101580	100.000000	16.858940

Mould Compound	Filler	Silica fused	60676-86-0	0.048631	55.000000	8.071147
Mould Compound	Filler	Silica	7631-86-9	0.026526	30.000000	4.402444
Mould Compound	Polymer	Phenolic resin		0.005305	6.000000	0.880455
Mould Compound	Polymer	Epoxy resin system		0.004863	5.500000	0.807098
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.002653	3.000000	0.440311
Mould Compound	Pigment	Carbon black	1333-86-4	0.000442	0.500000	0.073357
		Mould Compound Total		0.088420	100.000000	14.674812

Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.000039	0.009450	0.006473
		Foil Total		0.000039	0.009450	0.006473
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.264916	64.217610	43.967344
Substrate/Laminate	Impurity	Phosphorus (P)	7723-14-0	0.000037	0.008710	0.006141
		Plating 1 Total		0.264953	64.226320	43.973485
Substrate/Laminate	Pure metal layer	Nickel (Ni)	7440-02-0	0.000106	0.025710	0.017593
		Plating 2 Total		0.000106	0.025710	0.017593
Substrate/Laminate	Pure metal layer	Gold (Au)	7440-57-5	0.000692	0.167670	0.114849
		Plating 3 Total		0.000692	0.167670	0.114849
Substrate/Laminate	Pure metal layer	Palladium (Pd)	7440-05-3	0.002576	0.624480	0.427531
		Plating 4 Total		0.002576	0.624480	0.427531
Substrate/Laminate	Pure metal layer	Copper (Cu)	7440-50-8	0.000004	0.001000	0.000664
		Plating 5 Total		0.000004	0.001000	0.000664
Substrate/Laminate	Pure metal layer	Titanium (Ti)	7440-32-6	0.000034	0.008250	0.005643
		Plating 6 Total		0.000034	0.008250	0.005643
Substrate/Laminate	Fiberglass	Glass, oxide, chemicals (fibrous)	65997-17-3	0.063358	15.358520	10.515344
Substrate/Laminate	Polymer	Resin system		0.055238	13.389970	9.167691
Substrate/Laminate	Filler	Calcium fluoride	7789-75-5	0.000206	0.049970	0.034189
Substrate/Laminate	Impurity	Misc. chlorine compounds (generic)		0.000000	0.000100	0.000000
		Pre-preg Total		0.118802	28.798560	19.717224
Substrate/Laminate	Polymer	Acrylic resin		0.013315	3.227740	2.209852
Substrate/Laminate	Flame retardant	Barium sulfate (BaSO4)	7727-43-7	0.009242	2.240390	1.533868
Substrate/Laminate	Additive	Non-declarable		0.001469	0.355830	0.243806
Substrate/Laminate	Additive	Talc	14807-96-6	0.001087	0.263570	0.180406
Substrate/Laminate	Pigment	C.I. Pigment Blue 15	147-14-8	0.000190	0.046130	0.031534
Substrate/Laminate	Impurity	2-Benzyl-2-(dimethylamino)-1-(4-morpholinophenyl)-1-butanone	119313-12-1	0.000013	0.003100	0.002158
Substrate/Laminate	Impurity	Misc. chlorine compounds (generic)		0.000004	0.001070	0.000664
Substrate/Laminate	Impurity	(2,4,6-Trimethylbenzoyl)diphenylphosphine oxide	75980-60-8	0.000003	0.000730	0.000498
		Solder Mask Total		0.025323	6.138560	4.202786
		Substrate/Laminate Total		0.412529	100.000000	68.466248

		PESD5V0H1BLL-Q Total		0.602529		100.000000

Notes
Report created on 2025-09-08 08:49:58 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-09-08 08:49:58 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯苯 (PBB)	多溴二苯醚 (PBDE)
Semiconductor Substrate (Semiconductor Substrate)	?	?	?	?	?	?
底部金屬層1 (Under Bump Metallization 1)	?	?	?	?	?	?
底部金屬層2 (Under Bump Metallization 2)	?	?	?	?	?	?
Bumping 1 (Bumping 1)	?	?	?	?	?	?
Bumping 2 (Bumping 2)	?	?	?	?	?	?
鈍化層 (Passivation)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
銅箔 (Foil)	?	?	?	?	?	?
鍍層1 (Plating 1)	?	?	?	?	?	?
鍍層2 (Plating 2)	?	?	?	?	?	?
鍍層3 (Plating 3)	?	?	?	?	?	?
鍍層4 (Plating 4)	?	?	?	?	?	?
鍍層5 (Plating 5)	?	?	?	?	?	?
鍍層6 (Plating 6)	?	?	?	?	?	?
黏合膠片 (Pre-preg)	?	?	?	?	?	?
防焊綠漆 (Solder Mask)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	該半導體產品具有無限期的環保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-09-08 08:49:58 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 PESD5V0H1BLL-Q

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

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化學成分 PESD5V0H1BLL-Q

ESD保護、TVS、濾波和信號調節ESD保護