化學(xué)成分 NX6008NBKS

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過(guò)互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無(wú)鉛狀態(tài)合規(guī)評(píng)估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見(jiàn)限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934662515115	NX6008NBKSX	NX6008NBKS	SOT363 (SC-88)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 128783 ppm; substance 7440-48-4: 1550 ppm; substance 1333-86-4: 254 ppm; substance 7439-92-1: 3 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 128783 ppm; substance 7440-48-4: 1550 ppm; substance 1333-86-4: 254 ppm; substance 7439-92-1: 3 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 6708 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	0.370000	100.000000	6.446180
		Die Total		0.370000	100.000000	6.446180

Lead Frame	Iron-nickel alloy	Iron (Fe)	7439-89-6	0.981180	47.400000	17.094223
Lead Frame	Iron-nickel alloy	Nickel (Ni)	7440-02-0	0.739197	35.710000	12.878369
Lead Frame	Iron-nickel alloy	Manganese (Mn)	7439-96-5	0.017595	0.850000	0.306542
Lead Frame	Iron-nickel alloy	Cobalt (Co)	7440-48-4	0.008901	0.430000	0.155074
Lead Frame	Iron-nickel alloy	Silicon (Si)	7440-21-3	0.005382	0.260000	0.093766
Lead Frame	Iron-nickel alloy	Chromium (Cr)	7440-47-3	0.004347	0.210000	0.075734
Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.001863	0.090000	0.032457
Lead Frame	Iron-nickel alloy	Carbon (C)	7440-44-0	0.000828	0.040000	0.014425
Lead Frame	Iron-nickel alloy	Phosphorus (P)	7723-14-0	0.000414	0.020000	0.007213
Lead Frame	Iron-nickel alloy	Sulfur (S)	7704-34-9	0.000414	0.020000	0.007213
		Base Alloy FeNi42 Total		1.760121	85.030000	30.665016
Lead Frame	Pure metal layer	Copper (Cu)	7440-50-8	0.271377	13.110000	4.727959
		Pre-Plating 1 Total		0.271377	13.110000	4.727959
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.038502	1.860000	0.670786
		Pre-Plating 2 Total		0.038502	1.860000	0.670786
		Lead Frame Total		2.070000	100.000000	36.063761

Mould Compound	Filler	Silica	7631-86-9	2.102400	72.000000	36.628237
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	0.438000	15.000000	7.630883
Mould Compound	Polymer	Formaldehyde-phenol copolymer	9003-35-4	0.292000	10.000000	5.087255
Mould Compound	Additive	Non-declarable		0.084680	2.900000	1.475304
Mould Compound	Pigment	Carbon black	1333-86-4	0.001460	0.050000	0.025436
Mould Compound	Additive	Triphenylphosphine	603-35-0	0.001460	0.050000	0.025436
		Mould Compound Total		2.920000	100.000000	50.872551

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.369963	99.990000	6.445535
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000018	0.005000	0.000313
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000011	0.003000	0.000191
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000004	0.001000	0.000070
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000004	0.001000	0.000070
		Post-Plating Total		0.370000	100.000000	6.446179

Wire	Pure metal	Copper (Cu)	7440-50-8	0.009834	100.000000	0.171329
		Wire Total		0.009834	100.000000	0.171329

		NX6008NBKS Total		5.739834		100.000000

Notes
Report created on 2025-07-14 14:29:55 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-07-14 14:29:55 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預(yù)鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	該半導(dǎo)體產(chǎn)品具有無(wú)限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-07-14 14:29:55 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學(xué)成分 NX6008NBKS

雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 NX6008NBKS