化學成分 NGW75T65H3DFP

作為一家積極進取的可持續發展公司，安世半導體已決定直接通過互聯網發布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協助他們進行RoHS指令或無鉛狀態合規評估。客戶可以直接從一般產品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業設下的一個行業標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934668961127	NGW75T65H3DFPQ	NGW75T65H3DFP	SOT429-2 (TO247-3L)	RFS	None

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS); using exemption 8.1: '高熔點焊料 (如鉛含量超過85%（重量百分比）的鉛基合金焊料）'.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 139 ppm; substance 7439-92-1: 165 ppm; substance 1333-86-4: 1757 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 139 ppm; substance 7439-92-1: 165 ppm; substance 1333-86-4: 1757 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 40 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die 1	Doped silicon	Silicon (Si)	7440-21-3	12.763765	95.752180	0.211622
Die 1	Pure metal layer	Silver (Ag)	7440-22-4	0.227013	1.703020	0.003764
Die 1	Pure metal layer	Aluminium (Al)	7429-90-5	0.189353	1.420500	0.003139
Die 1	Polymer	Non-declarable		0.100287	0.752340	0.001663
Die 1	Pure metal layer	Nickel (Ni)	7440-02-0	0.041167	0.308830	0.000683
Die 1	Pure metal layer	Titanium (Ti)	7440-32-6	0.008415	0.063130	0.000139
		Die 1 Total		13.330000	100.000000	0.221010

Die 2	Doped silicon	Silicon (Si)	7440-21-3	4.760000	100.000000	0.078920
		Die 2 Total		4.760000	100.000000	0.078920

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	4034.591604	99.878490	66.893086
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	2.827650	0.070000	0.046882
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	1.211850	0.030000	0.020092
Lead Frame	Impurity	Lead (Pb)	7439-92-1	0.060996	0.001510	0.001011
Lead Frame	Impurity	Non-declarable		0.008079	0.000200	0.000134
		Base Alloy C19210 Total		4038.700179	99.980200	66.961205
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.799821	0.019800	0.013261
		Pre-Plating Total		0.799821	0.019800	0.013261
		Lead Frame Total		4039.500000	100.000000	66.974466

Mould Compound	Filler	Silica fused	60676-86-0	1646.544595	85.450000	27.299528
Mould Compound	Polymer	Epoxy resin system		144.518250	7.500000	2.396097
Mould Compound	Additive	Non-declarable		57.807300	3.000000	0.958438
Mould Compound	Hardener	Phenolic resin		57.807300	3.000000	0.958439
Mould Compound	Pigment	Carbon black	1333-86-4	10.598005	0.550000	0.175714
Mould Compound	Additive	Non-declarable		9.634550	0.500000	0.159740
		Mould Compound Total		1926.910000	100.000000	31.947956

Post-Plating	Pure metal layer	Tin (Sn)	7440-31-5	29.527047	99.990000	0.489555
Post-Plating	Impurity	Non-declarable		0.002953	0.010000	0.000049
		Post-Plating Total		29.530000	100.000000	0.489604

Wire 1	Pure metal	Aluminium (Al)	7429-90-5	0.188124	99.990000	0.003119
Wire 1	Impurity	Nickel (Ni)	7440-02-0	0.000011	0.006000	0.000001
Wire 1	Impurity	Copper (Cu)	7440-50-8	0.000002	0.001000	0.000000
Wire 1	Impurity	Magnesium (Mg)	7439-95-4	0.000002	0.001000	0.000000
Wire 1	Impurity	Silicon (Si)	7440-21-3	0.000002	0.001000	0.000000
Wire 1	Impurity	Iron (Fe)	7439-89-6	0.000001	0.001000	0.000000
		Wire 1 Total		0.188142	100.000000	0.003120

Wire 2	Pure metal	Aluminium (Al)	7429-90-5	16.183286	99.990000	0.268317
Wire 2	Impurity	Nickel (Ni)	7440-02-0	0.000971	0.006000	0.000016
Wire 2	Impurity	Copper (Cu)	7440-50-8	0.000162	0.001000	0.000003
Wire 2	Impurity	Iron (Fe)	7439-89-6	0.000162	0.001000	0.000002
Wire 2	Impurity	Magnesium (Mg)	7439-95-4	0.000162	0.001000	0.000003
Wire 2	Impurity	Silicon (Si)	7440-21-3	0.000162	0.001000	0.000003
		Wire 2 Total		16.184905	100.000000	0.268344

Solder Wire	Lead alloy	Lead (Pb)	7439-92-1	0.935000	93.500000	0.015502
Solder Wire	Lead alloy	Tin (Sn)	7440-31-5	0.050000	5.000000	0.000829
Solder Wire	Lead alloy	Silver (Ag)	7440-22-4	0.015000	1.500000	0.000249
		Solder Wire Total		1.000000	100.000000	0.016580

		NGW75T65H3DFP Total		6031.403047		100.000000

Notes
Report created on 2025-09-08 08:49:54 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯苯 (PBB)	多溴二苯醚 (PBDE)
半導體芯片 (Die)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預鍍層 (Pre-Plating)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
焊錫絲 (Solder Wire)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	該半導體產品的環保使用期限（EFUP）為50年。 This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

Notes
Report created on 2025-09-08 08:49:54 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 NGW75T65H3DFP

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 NGW75T65H3DFP

ESD保護、TVS、濾波和信號調節ESD保護