化學(xué)成分 GS10M

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標(biāo)準。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934669020118	GS10MJ	GS10M	SOD1003-1 (SMC)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 43896 ppm of the article. SCIP No. 2b34f063-86fa-4901-a594-45179d504748.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'; using exemption 7(c)-I: 'Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound.'.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS); using exemption 8.1: '高熔點焊料 (如鉛含量超過85%（重量百分比）的鉛基合金焊料）'; using exemption 8.3.1: '陶瓷及玻璃：用于除介電陶瓷電容以外的電子電氣元器件 (例如，壓電器件、玻璃和陶瓷的復(fù)合材料）'.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'; using exemption 10(a): 'Electrical and electronic components, which contain lead in a glass or ceramic, in a glass or ceramic matrix compound, in a glass-ceramic material, or in a glass-ceramic matrix compound.'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 65997-17-3: 589 ppm; substance 7440-02-0: 269 ppm; substance 1333-86-4: 6124 ppm; substance 7439-92-1: 43896 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 65997-17-3: 589 ppm; substance 7440-02-0: 269 ppm; substance 1333-86-4: 6124 ppm; substance 7439-92-1: 43896 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-57-5: 10 ppm; substance 7440-22-4: 1133 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	5.185958	95.120288	1.868464
Die	Lead borosilicate glass	Lead borosilicate glass (generic)	65997-17-3	0.163631	3.001308	0.058955
Die	Pure metal layer	Nickel (Ni)	7440-02-0	0.074753	1.371107	0.026933
Die	Oxide Ceramics	Quartz (SiO2)	14808-60-7	0.024954	0.457702	0.008991
Die	Pure metal layer	Gold (Au)	7440-57-5	0.002704	0.049595	0.000974
		Die Total		5.452000	100.000000	1.964317

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	74.916045	99.888060	26.991715
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.062977	0.083970	0.022690
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.020978	0.027970	0.007558
		Lead Frame Total		75.000000	100.000000	27.021963

Mould Compound	Filler	Silica fused	60676-86-0	147.900000	87.000000	53.287312
Mould Compound	Polymer	Epoxy resin system		5.100000	3.000000	1.837494
Mould Compound	Polymer	Phenolic resin		5.100000	3.000000	1.837494
Mould Compound	Filler	Silica	7631-86-9	5.100000	3.000000	1.837493
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	5.100000	3.000000	1.837493
Mould Compound	Filler	Carbon black	1333-86-4	1.700000	1.000000	0.612498
		Mould Compound Total		170.000000	100.000000	61.249784

Post-Plating	Pure metal	Tin (Sn)	7440-31-5	13.997200	99.980000	5.043091
Post-Plating	Impurity	Non-declarable		0.002170	0.015500	0.000782
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000630	0.004500	0.000227
		Post-Plating Total		14.000000	100.000000	5.044100

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	12.183000	93.000000	4.389448
Solder Paste	Lead alloy	Tin (Sn)	7440-31-5	0.602600	4.600000	0.217112
Solder Paste	Lead alloy	Silver (Ag)	7440-22-4	0.314400	2.400000	0.113276
		Solder Paste Total		13.100000	100.000000	4.719836

		GS10M Total		277.552000		100.000000

Notes
Report created on 2025-09-08 08:49:53 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-09-08 08:49:53 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
錫膏 (Solder Paste)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	該半導(dǎo)體產(chǎn)品的環(huán)保使用期限（EFUP）為50年。 This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

Notes
Report created on 2025-09-08 08:49:53 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產(chǎn)品

雙極性晶體管

二極管

ESD保護、TVS、信號調(diào)節(jié)

MOSFET

SiC MOSFETs

氮化鎵場效應(yīng)晶體管(GaN FET)

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Interactive application notes

Advanced Support Tools

化學(xué)成分 GS10M

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 GS10M

ESD保護、TVS、濾波和信號調(diào)節(jié)ESD保護