化學成分 GAN063-650WSA

作為一家積極進取的可持續發展公司，安世半導體已決定直接通過互聯網發布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協助他們進行RoHS指令或無鉛狀態合規評估。客戶可以直接從一般產品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業設下的一個行業標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934660022127	GAN063-650WSAQ	GAN063-650WSA	SOT429 (TO-247)	DOD	None

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 594596 ppm of the article. SCIP No. 2288eb25-b36c-4522-87ce-ebdbe1815153.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS); using exemption 8.1: '高熔點焊料 (如鉛含量超過85%（重量百分比）的鉛基合金焊料）'.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 988 ppm; substance 1333-86-4: 618 ppm; substance 7439-92-1: 594596 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 988 ppm; substance 1333-86-4: 618 ppm; substance 7439-92-1: 594596 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 16192 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	1.848000	77.000000	0.012120
Adhesive	Polymer	Resin system		0.552000	23.000000	0.003621
		Adhesive Total		2.400000	100.000000	0.015741

Die 1	Doped silicon	Silicon (Si)	7440-21-3	24.500000	98.000000	0.160686
Die 1	Metallisation	Gallium nitride (GaN)	25617-97-4	0.500000	2.000000	0.003279
		Die 1 Total		25.000000	100.000000	0.163965

Die 2	Doped silicon	Silicon (Si)	7440-21-3	0.980000	100.000000	0.006427
		Die 2 Total		0.980000	100.000000	0.006427

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	3262.362347	99.530000	21.396497
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	15.077732	0.460000	0.098889
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.327777	0.010000	0.002150
		Lead Frame Total		3277.767856	100.000000	21.497536

Mould Compound	Filler	Silica fused	60676-86-0	1413.750000	75.000000	9.272207
Mould Compound	Polymer	Epoxy resin system		367.575000	19.500000	2.410774
Mould Compound	Flame retardant	Melamine cyanurate	37640-57-6	94.250000	5.000000	0.618147
Mould Compound	Pigment	Carbon black	1333-86-4	9.425000	0.500000	0.061814
		Mould Compound Total		1885.000000	100.000000	12.362942

Post-Plating	Pure metal layer	Tin (Sn)	7440-31-5	10.898910	99.990000	0.071482
Post-Plating	Impurity	Non-declarable		0.001090	0.010000	0.000007
		Post-Plating Total		10.900000	100.000000	0.071489

Wire 1	Pure metal	Aluminium (Al)	7429-90-5	2.982060	100.000000	0.019558
		Wire 1 Total		2.982060	100.000000	0.019558

Wire 2	Pure metal	Aluminium (Al)	7429-90-5	0.429417	100.000000	0.002816
		Wire 2 Total		0.429417	100.000000	0.002816

Solder Paste	Tin alloy	Tin (Sn)	7440-31-5	0.482500	96.500000	0.003165
Solder Paste	Tin alloy	Silver (Ag)	7440-22-4	0.015000	3.000000	0.000098
Solder Paste	Tin alloy	Copper (Cu)	7440-50-8	0.002500	0.500000	0.000016
		Solder Paste Total		0.500000	100.000000	0.003279

Ferrite	Oxide Ceramics	metal oxide ceramics composite		47.220000	100.000000	0.309697
		Ferrite Total		47.220000	100.000000	0.309697

Shim	Pure metal	Copper (Cu)	7440-50-8	96.500000	50.000000	0.632904
Shim	Oxide Ceramics	metal oxide ceramics composite		96.500000	50.000000	0.632904
		Shim Total		193.000000	100.000000	1.265808

Solder Preform	Lead alloy	Lead (Pb)	7439-92-1	9065.925000	92.500000	59.459686
Solder Preform	Lead alloy	Tin (Sn)	7440-31-5	490.050000	5.000000	3.214037
Solder Preform	Lead alloy	Silver (Ag)	7440-22-4	245.025000	2.500000	1.607019
		Solder Preform Total		9801.000000	100.000000	64.280742

		GAN063-650WSA Total		15247.179333		100.000000

Notes
Report created on 2025-09-08 08:49:53 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯苯 (PBB)	多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?
錫膏 (Solder Paste)	?	?	?	?	?	?
鐵氧體 (Ferrite)	?	?	?	?	?	?
墊片 (Shim)	?	?	?	?	?	?
Solder Preform (Solder Preform)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	該半導體產品的環保使用期限（EFUP）為50年。 This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

Notes
Report created on 2025-09-08 08:49:53 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 GAN063-650WSA

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 GAN063-650WSA