化學成分 BUK9M6R0-40H

作為一家積極進取的可持續發展公司，安世半導體已決定直接通過互聯網發布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協助他們進行RoHS指令或無鉛狀態合規評估。客戶可以直接從一般產品數據庫檢索中獲取這些詳細的數據，這是安世半導體為半導體產業設下的一個行業標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934660794115	BUK9M6R0-40HX	BUK9M6R0-40H	SOT1210 (mLFPAK)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 109170 ppm of the article. SCIP No. cdbb7a23-452f-4362-84bb-246453475f35.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS); using exemption 8.1: '高熔點焊料 (如鉛含量超過85%（重量百分比）的鉛基合金焊料）'.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 1133 ppm; substance 7439-92-1: 109170 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 1133 ppm; substance 7439-92-1: 109170 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 2951 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	1.200000	100.000000	3.189793
		Die Total		1.200000	100.000000	3.189793

Clip	Copper alloy	Copper (Cu)	7440-50-8	5.688600	99.800000	15.121212
Clip	Copper alloy	Iron (Fe)	7439-89-6	0.008550	0.150000	0.022727
Clip	Copper alloy	Phosphorus (P)	7723-14-0	0.002850	0.050000	0.007576
		Clip Total		5.700000	100.000000	15.151515

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	13.872200	99.800000	36.874535
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.020850	0.150000	0.055423
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.006950	0.050000	0.018474
		Lead Frame Total		13.900000	100.000000	36.948432

Mould Compound	Filler	Silica fused	60676-86-0	5.288600	62.000000	14.057948
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	1.322150	15.500000	3.514487
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	0.938300	11.000000	2.494152
Mould Compound	Polymer	Phenolic resin		0.750640	8.800000	1.995322
Mould Compound	Polymer	3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer	89118-70-7	0.170600	2.000000	0.453482
Mould Compound	Pigment	Carbon black	1333-86-4	0.042650	0.500000	0.113370
Mould Compound	Impurity	Quartz (SiO2)	14808-60-7	0.017060	0.200000	0.045348
		Mould Compound Total		8.530000	100.000000	22.674109

Post-Plating	Tin alloy	Tin (Sn)	7440-31-5	3.849615	99.990000	10.232895
Post-Plating	Impurity	Non-declarable		0.000385	0.010000	0.001023
		Post-Plating Total		3.850000	100.000000	10.233918

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	4.107000	92.500000	10.917065
Solder Paste	Lead alloy	Tin (Sn)	7440-31-5	0.222000	5.000000	0.590112
Solder Paste	Lead alloy	Silver (Ag)	7440-22-4	0.111000	2.500000	0.295056
		Solder Paste Total		4.440000	100.000000	11.802233

		BUK9M6R0-40H Total		37.620000		100.000000

Notes
Report created on 2025-09-01 09:33:32 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-09-01 09:33:32 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯苯 (PBB)	多溴二苯醚 (PBDE)
半導體芯片 (Die)	?	?	?	?	?	?
夾子 (Clip)	?	?	?	?	?	?
引線框架 (Lead Frame)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
錫膏 (Solder Paste)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	該半導體產品的環保使用期限（EFUP）為50年。 This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

Notes
Report created on 2025-09-01 09:33:32 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產品

雙極性晶體管

二極管

ESD保護、TVS、信號調節

MOSFET

SiC MOSFETs

氮化鎵場效應晶體管(GaN FET)

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所有應用

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Sub-systems: Power conversion topologies

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Interactive application notes

Advanced Support Tools

化學成分 BUK9M6R0-40H

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 BUK9M6R0-40H